The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 06, 2021

Filed:

Dec. 06, 2017
Applicant:

Commissariat À L'energie Atomique ET Aux Energies Alternatives, Paris, FR;

Inventors:

Frank Fournel, Villard-Bonnot, FR;

Ali Dekious, Castelnau-les-Lez, FR;

Emilie Deloffre, Saint-Ismier, FR;

Gilles Despaux, Saint-Georges-d'Orques, FR;

Vincent Larrey, La Murette, FR;

Emmanuel Le Clezio, Les Matelles, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 29/46 (2006.01); G01N 29/04 (2006.01); G01N 29/11 (2006.01);
U.S. Cl.
CPC ...
G01N 29/46 (2013.01); G01N 29/043 (2013.01); G01N 29/11 (2013.01); G01N 2291/015 (2013.01); G01N 2291/02827 (2013.01); G01N 2291/0427 (2013.01); G01N 2291/101 (2013.01); G01N 2291/267 (2013.01);
Abstract

The invention relates to a method for checking an assembly comprising first (W) and second (W) joined substrates, comprising the following steps: a) transmitting an ultrasonic excitation signal towards the assembly by means of an ultrasonic transducer () located on the front face (A) side of the first substrate (W); b) measuring, using the transducer (), an ultrasonic feedback signal including at least one echo (EF) of the excitation signal on the rear face (B) of the second substrate (W); c) calculating, using a processing circuit (), a spectral signal representative of the change in frequency of an overall reflection coefficient of the assembly, defined as the ratio between the feedback signal measured in step b) and the excitation signal; and d) deriving, from said spectral signal, information relating to the quality of the bond between the first (W) and second (W) substrates.


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