The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 20, 2026

Filed:

May. 12, 2023
Applicant:

Commissariat À L'energie Atomique ET Aux Energies Alternatives, Paris, FR;

Inventors:

Frank Fournel, Grenoble, FR;

Aziliz Calvez, Grenoble, FR;

Vincent Larrey, Grenoble, FR;

Christophe Morales, Grenoble, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/762 (2006.01); H01L 21/02 (2006.01); H01L 21/324 (2006.01);
U.S. Cl.
CPC ...
H01L 21/762 (2013.01); H01L 21/0206 (2013.01); H01L 21/324 (2013.01);
Abstract

A method for manufacturing a multilayer structure by direct bonding between a first substrate and a second substrate, the method including the steps of: providing a first substrate and a second substrate respectively including a first bonding surface and a second bonding surface, contacting the first bonding surface and the second bonding surface so as to create a direct bonding interface between the first substrate and the second substrate, placing at least the direct bonding interface in a cationic aqueous solution including deionized water and cationic species originating from at least one element of the first and/or of the second column of the periodic table of elements, and applying a heat treatment at a temperature comprised between 20° C. and 350° C. so as to obtain the multilayer structure.


Find Patent Forward Citations

Loading…