Taipei County, Taiwan

Tzung-Chi Lee


Average Co-Inventor Count = 4.8

ph-index = 6

Forward Citations = 67(Granted Patents)


Location History:

  • Hsinchu, TW (2009 - 2010)
  • Hsin Banciao, TW (2013)
  • Taipei County, TW (2018 - 2021)
  • Banciao, TW (2012 - 2024)

Company Filing History:


Years Active: 2009-2025

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18 patents (USPTO):Explore Patents

Title: Innovations by Tzung-Chi Lee: Pioneering High-Density Device Technology

Introduction: Tzung-Chi Lee is a prominent inventor based in Taipei County, Taiwan, known for his substantial contributions to semiconductor technology. With a remarkable portfolio of 18 patents, Lee has established himself as a key figure in the field, particularly in the development of integrated circuits and high-density devices.

Latest Patents: One of Lee's notable recent patents is titled "Dummy Poly Layout for High Density Devices." This invention addresses the need for increased efficiency in integrated circuit design. It details a design where an array of poly lines on an active device area of an integrated chip is extended to form a dummy device structure on an adjacent isolation region. The innovative approach uses poly lines that match the line width, spacing, and pitch of those on the active device area. This alignment enhances the proximity of the dummy device structure to the active component, consequently improving anti-dishing performance and effectively reducing the amount of empty space on the integrated chip.

Career Highlights: Throughout his professional journey, Tzung-Chi Lee has played a pivotal role in advancing semiconductor technology. His expertise and innovations have been instrumental in enhancing the performance and efficiency of high-density devices. Notably, he has contributed significantly while working with Taiwan Semiconductor Manufacturing Company Ltd., where his insights and inventions have influenced industry standards.

Collaborations: Tzung-Chi Lee has collaborated with several distinguished professionals in the field, including Tung-Heng Hsieh and Bao-Ru Young. These collaborations have led to innovative breakthroughs and have further cemented Lee's reputation as a leading inventor in semiconductor design.

Conclusion: Tzung-Chi Lee's contributions to the field of high-density device technology reflect his dedication to innovation and excellence. His patents, particularly the recent advancements in dummy poly layouts, showcase his ability to solve complex challenges in integrated circuit design. As he continues to push boundaries, the impact of his work is sure to be felt across the semiconductor industry for years to come.

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