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Hsinchu, Taiwan

Tzu-Wei Chiu

This inventor holds 20 USPTO granted patents and 1 published patent application, primarily in Semiconductor Packaging. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2012-2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tzu-Wei Chiu. Retrieved from https://idiyas.com/inventor/tzu-wei-chiu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 20 

% Patents Active = 85.0

Average Co-Inventor Count = 3.2

ph-index = 5

Forward Citations = 970(Granted Patents)


Company Filing History:

goldMedal20 out of 42,965 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2012-2023

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Areas of Expertise:
3D Packages
Fan-Out Package
Bump Structure
Yield Improvement
Passivation Layer
Stress Buffer Structures
Interposers
Manufacturing Methods
Seal Ring Structure
Polyimide Layer
Semiconductor Device
Mounting Structure
20 patents (USPTO):Explore Patents
1. 11830745 - 3D packages and methods for forming the same (2023-11-28),
2. 11715681 - Fan-out package structure and method (2023-08-01),
3. 11107758 - Fan-out package structure and method (2021-08-31),
4. 11069539 - 3D packages and methods for forming the same (2021-07-20),
5. 10665474 - 3D packages and methods for forming the same (2020-05-26),
6. 10510648 - Fan-out package structure and method (2019-12-17),
7. 10269584 - 3D packages and methods for forming the same (2019-04-23),
8. 10163770 - Fan-out package structure and method (2018-12-25),
9. 10056347 - Bump structure for yield improvement (2018-08-21),
10. 9953911 - Fan-out package structure and method (2018-04-24),
11. 9570366 - Passivation layer for packaged chip (2017-02-14),
12. 9553053 - Bump structure for yield improvement (2017-01-24),
13. 9337118 - Stress buffer structures in a mounting structure of a semiconductor device (2016-05-10),
14. 9299649 - 3D packages and methods for forming the same (2016-03-29),
15. 8906798 - Methods of manufacturing stress buffer structures in a mounting structure of a semiconductor device (2014-12-09),

Title: The Innovative Journey of Tzu-Wei Chiu

Introduction: Tzu-Wei Chiu, a pioneering inventor hailing from Hsinchu, Taiwan, has made significant contributions to the world of technology through his groundbreaking innovations.

Latest Patents: Tzu-Wei Chiu's latest patents focus on advancements in semiconductor technology, particularly in the field of nanoelectronics and integrated circuits.

Career Highlights: With a career spanning over two decades, Tzu-Wei Chiu has held key positions in leading tech companies, where he spearheaded research and development projects that have led to numerous patented inventions.

Collaborations: Throughout his career, Tzu-Wei Chiu has collaborated with top researchers, engineers, and scientists from around the globe, fostering a culture of innovation and excellence in the tech industry.

Conclusion: Tzu-Wei Chiu's relentless pursuit of innovation and his passion for pushing the boundaries of technology have solidified his reputation as a visionary inventor in the ever-evolving world of semiconductor technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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