The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 24, 2017
Filed:
Jul. 25, 2012
Tzu-wei Chiu, Hsin-Chu, TW;
Tzu-yu Wang, Taipei, TW;
Shang-yun Hou, Jubei, TW;
Shin-puu Jeng, Hsin-Chu, TW;
Hsien-wei Chen, Hsin-Chu, TW;
Hung-an Teng, Taoyuan, TW;
Wei-cheng Wu, Hsinchu, TW;
Tzu-Wei Chiu, Hsin-Chu, TW;
Tzu-Yu Wang, Taipei, TW;
Shang-Yun Hou, Jubei, TW;
Shin-Puu Jeng, Hsin-Chu, TW;
Hsien-Wei Chen, Hsin-Chu, TW;
Hung-An Teng, Taoyuan, TW;
Wei-Cheng Wu, Hsinchu, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
A bump structure for electrically coupling semiconductor components is provided. The bump structure includes a first bump on a first semiconductor component and a second bump on a second semiconductor component. The first bump has a first non-flat portion (e.g., a convex projection) and the second bump has a second non-flat portion (e.g., a concave recess). The bump structure also includes a solder joint formed between the first and second non-flat portions to electrically couple the semiconductor components.