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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9953911 B1

PDFFull Text
Date of Patent:
Apr. 24, 2018

Filed:

Jul. 01, 2016

Fan-out package structure and method

Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;

Inventors:

Tzu-Wei Chiu, Hsin-Chu, TW;

Sao-Ling Chiu, Hsin-Chu, TW;

Assignee:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;

Attorney:

Slater Matsil, LLP

Primary Examiner:

Andy Huynh

Int. Cl.
CPC ...
H01L 29/40 (2006.01); H01L 23/498 (2006.01); H01L 21/56 (2006.01); H01L 21/48 (2006.01); H01L 21/683 (2006.01); H01L 23/532 (2006.01); H01L 21/60 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49822 (2013.01); H01L 21/486 (2013.01); H01L 21/4846 (2013.01); H01L 21/4853 (2013.01); H01L 21/568 (2013.01); H01L 21/6835 (2013.01); H01L 23/49805 (2013.01); H01L 23/49811 (2013.01); H01L 23/49827 (2013.01); H01L 23/53228 (2013.01); H01L 23/53233 (2013.01); H01L 2021/6006 (2013.01); H01L 2221/68372 (2013.01); H01L 2221/68381 (2013.01);
Abstract

A method includes attaching a semiconductor structure on a carrier, depositing a molding compound layer over the carrier, wherein the semiconductor structure is embedded in the molding compound layer, exposing a first photo-sensitive material layer and a second photo-sensitive material layer to light, developing the first photo-sensitive material layer and the second photo-sensitive material layer to form an opening having a first portion in the first photo-sensitive material layer and a second portion in the second photo-sensitive material layer, wherein a width of the second portion is greater than a width of the first portion, filling the opening with a conductive material to form a via in the first photo-sensitive material layer and a redistribution layer in the second photo-sensitive material layer and forming a bump over the redistribution layer.

Find Patent Forward Citations

Chiu, Tzu-Wei. (2018). Fan-out package structure and method (U.S. Patent No. 9953911). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9953911

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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