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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10163770 B1

PDFFull Text
Date of Patent:
Dec. 25, 2018

Filed:

Feb. 28, 2018

Fan-out package structure and method

Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Tzu-Wei Chiu, Hsinchu, TW;

Sao-Ling Chiu, Hsinchu, TW;

Assignee:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;

Attorney:

Slater Matsil, LLP

Primary Examiner:

Andy Huynh

Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 21/683 (2006.01); H01L 23/00 (2006.01); H01L 23/532 (2006.01); H01L 21/60 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49822 (2013.01); H01L 21/486 (2013.01); H01L 21/4846 (2013.01); H01L 21/4853 (2013.01); H01L 21/568 (2013.01); H01L 21/6835 (2013.01); H01L 23/49805 (2013.01); H01L 23/49811 (2013.01); H01L 23/49827 (2013.01); H01L 24/19 (2013.01); H01L 23/53228 (2013.01); H01L 23/53233 (2013.01); H01L 2021/6006 (2013.01); H01L 2221/68372 (2013.01); H01L 2221/68381 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/18 (2013.01); H01L 2924/18162 (2013.01);
Abstract

A device comprises a semiconductor structure in a molding compound layer, a first polymer layer on the molding compound layer, a second polymer layer on the first polymer layer, a first interconnect structure having a first via portion in the first polymer layer and a first metal line portion in the second polymer layer, a third polymer layer on the second polymer layer, a fourth polymer layer on the third polymer layer and a second interconnect structure having a second via portion in the third polymer layer and a second metal line portion in the fourth polymer layer, wherein the second via portion is vertically aligned with the first via portion.

Find Patent Forward Citations

Chiu, Tzu-Wei. (2018). Fan-out package structure and method (U.S. Patent No. 10163770). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10163770

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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