Company Filing History:

13 out of 9,138

Industrial Technology Research Institute

patents

4 out of 293

Silicon Integrated Systems Corporation

patents

1 out of 544

National Science Council

patents

Years Active: 1997-2019

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18 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 10416114 - Structures and manufacture method of electrochemical units (2019-09-17),

2. 9368475 - Semiconductor device and manufacturing method thereof (2016-06-14),

3. 9257338 - TSV substrate structure and the stacked assembly thereof (2016-02-09),

4. 9257322 - Method for manufacturing through substrate via (TSV), structure and control method of TSV capacitance (2016-02-09),

5. 9093312 - Semiconductor device and manufacturing method thereof (2015-07-28),

6. 8445995 - Semiconductor structure with conductive plug in an oxide layer (2013-05-21),

7. 8309402 - Method of fabricating oxide material layer with openings attached to device layers (2012-11-13),

8. 6784075 - Method of forming shallow trench isolation with silicon oxynitride barrier film (2004-08-31),

9. 6743690 - Method of forming a metal-oxide semiconductor transistor (2004-06-01),

10. 6720235 - Method of forming shallow trench isolation in a semiconductor substrate (2004-04-13),

11. 6713379 - Method for forming a damascene structure (2004-03-30),

12. 6258716 - CVD titanium silicide for contact hole plugs (2001-07-10),

13. 6184135 - Insitu formation of TiSi2/TiN bi-layer structures using self-aligned nitridation treatment on underlying CVD-TiSi2 layer (2001-02-06),

14. 6184130 - Silicide glue layer for W-CVD plug application (2001-02-06),

15. 6071552 - Insitu formation of TiSi.sub.2 /TiN bi-layer structures using (2000-06-06),

Title: Tzu-Kun Ku: Innovator in Electrochemical and Semiconductor Technologies

Introduction

Tzu-Kun Ku is an accomplished inventor based in Taipei, Taiwan, who has made significant contributions to the fields of electrochemical units and semiconductor devices. With a portfolio of 18 patents, his innovative work reflects a commitment to enhancing technological efficiency and performance.

Latest Patents

One of Tzu-Kun Ku's latest patents is focused on the "Structures and manufacture method of electrochemical units." This patent delineates a structure for an electrochemical unit featuring a substrate and a first metal layer, with an array of electrochemical cells strategically placed upon it. Each electrochemical cell comprises various layers, including electrodes and polymers, designed to enhance functionality through innovative cavity and pore configurations.

Another significant patent by Ku is for a "Semiconductor device and manufacturing method thereof." This invention outlines a novel manufacturing process wherein a mould with a chamber and intricate patterns is utilized to create an interposer substrate. The method involves injecting and curing a thermosetting material to form conductive structures that enhance the operational efficiency of semiconductor devices.

Career Highlights

Tzu-Kun Ku's career has seen him make substantial contributions while working at key organizations. Notable among these are the Industrial Technology Research Institute and Silicon Integrated Systems Corporation, where he has played a crucial role in driving forward technological advancements in his field.

Collaborations

Throughout his career, Tzu-Kun Ku has collaborated with noteworthy professionals such as Cha-Hsin Lin and Pei-Jer Tzeng. These partnerships have facilitated a vibrant exchange of ideas and fostered innovative solutions in the areas of electrochemical and semiconductor technologies.

Conclusion

In conclusion, Tzu-Kun Ku exemplifies the spirit of innovation through his extensive patent portfolio and professional undertakings. His work has paved the way for enhanced technologies in electrochemical units and semiconductor devices, underscoring his impact in the field. As he continues to innovate, Tzu-Kun Ku remains a significant figure in technological advancement.

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