The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 09, 2016

Filed:

Feb. 06, 2015
Applicant:

Industrial Technology Research Institute, Hsin-Chu, TW;

Inventors:

Chung-Chih Wang, Taipei County, TW;

Pei-Jer Tzeng, Hsinchu, TW;

Cha-Hsin Lin, Tainan, TW;

Tzu-Kun Ku, Hsinchu, TW;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/40 (2006.01); H01L 21/768 (2006.01); H01L 23/48 (2006.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01); H01L 21/321 (2006.01); H01L 21/3213 (2006.01); H01L 25/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76898 (2013.01); H01L 21/3212 (2013.01); H01L 21/32133 (2013.01); H01L 21/76865 (2013.01); H01L 21/76871 (2013.01); H01L 21/76883 (2013.01); H01L 23/481 (2013.01); H01L 23/5384 (2013.01); H01L 23/562 (2013.01); H01L 25/50 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05009 (2013.01); H01L 2224/0557 (2013.01); H01L 2224/13 (2013.01); H01L 2224/13009 (2013.01); H01L 2224/13023 (2013.01); H01L 2224/16 (2013.01); H01L 2224/16146 (2013.01); H01L 2224/81 (2013.01); H01L 2224/8114 (2013.01); H01L 2224/81911 (2013.01); H01L 2225/06541 (2013.01); H01L 2924/00014 (2013.01);
Abstract

The disclosure provides a TSV substrate structure and the stacked assembly of a plurality of the substrate structures, the TSV substrate structure including: a substrate comprising a first surface, a corresponding second surface, and a TSV communicating the first surface with the second surface through the substrate; and a conductor unit completely filling the TSV, the conductor unit comprising a conductor body which has a first and a second ends corresponding to the first and second surfaces of the substrate, respectively.


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