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For the Inventor, By the Inventor

Taipei, Taiwan

Tung-Ching Tseng

USPTO Granted Patents = 13 

Average Co-Inventor Count = 3.2

ph-index = 3

Forward Citations = 29(Granted Patents)


Location History:

  • Shindian, TW (2003)
  • Hsindian, TW (2004)
  • Taipei, TW (2004 - 2022)

Company Filing History:

goldMedal13 out of 40,635 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2003-2022

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13 patents (USPTO):
1. 11532459 - Chemical vapor deposition apparatus with cleaning gas flow guiding member (2022-12-20),
2. 11315810 - Apparatus for wafer processing (2022-04-26),
3. 10121698 - Method of manufacturing a semiconductor device (2018-11-06),
4. 9548241 - Semiconductor device metallization systems and methods (2017-01-17),
5. 9318364 - Semiconductor device metallization systems and methods (2016-04-19),
6. 7297632 - Scratch reduction for chemical mechanical polishing (2007-11-20),
7. 7109117 - Method for chemical mechanical polishing of a shallow trench isolation structure (2006-09-19),
8. 7016790 - In-line hot-wire sensor for slurry monitoring (2006-03-21),
9. 6930040 - Method of forming a contact on a silicon-on-insulator wafer (2005-08-16),
10. 6812069 - Method for improving semiconductor process wafer CMP uniformity while avoiding fracture (2004-11-02),
11. 6686284 - Chemical mechanical polisher equipped with chilled retaining ring and method of using (2004-02-03),
12. 6579151 - Retaining ring with active edge-profile control by piezoelectric actuator/sensors (2003-06-17),
13. 6579150 - Dual detection method for end point in chemical mechanical polishing (2003-06-17),

Title: The Innovations of Tung-Ching Tseng

Introduction

Tung-Ching Tseng is a prominent inventor based in Taipei, Taiwan. He has made significant contributions to the field of semiconductor manufacturing, holding a total of 13 patents. His work primarily focuses on chemical vapor deposition and wafer processing technologies.

Latest Patents

One of his latest patents is a chemical vapor deposition apparatus with a cleaning gas flow guiding member. This innovative CVD apparatus includes a chamber with multiple wall portions and a pedestal designed to support a substrate. A gas inlet port is strategically placed below the substrate support portion, allowing for efficient gas flow. The gas flow guiding member is coupled to the gas inlet port, enabling the dispensing of cleaning gases into the CVD chamber.

Another notable patent is an apparatus for wafer processing. This apparatus features a wafer pedestal that supports a wafer, along with a radiation source that provides electromagnetic radiation to the wafer. A transparent window is positioned between the wafer pedestal and the radiation source, featuring a rough surface with an Ra value between approximately 0.5 µm and 100 µm. This design enhances the efficiency of the wafer processing.

Career Highlights

Tung-Ching Tseng is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His expertise in chemical vapor deposition and wafer processing has positioned him as a key player in advancing semiconductor technologies.

Collaborations

Throughout his career, Tseng has collaborated with notable colleagues, including Syun-Ming Jang and Hsiang-Huan Lee. These collaborations have contributed to the development of innovative technologies in the semiconductor field.

Conclusion

Tung-Ching Tseng's contributions to the semiconductor industry through his patents and innovative technologies have made a significant impact. His work continues to influence advancements in chemical vapor deposition and wafer processing, solidifying his reputation as a leading inventor in the field.

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