The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 19, 2016
Filed:
Jan. 13, 2014
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Hsiang-Huan Lee, Jhudong Township, TW;
Shau-Lin Shue, Hsin-Chu, TW;
Keith Kuang-Kuo Koai, Taoyuan, TW;
Hai-Ching Chen, Hsin-Chu, TW;
Tung-Ching Tseng, Taipei, TW;
Wen-Cheng Yang, Hsin-Chu, TW;
Chung-En Kao, Toufen Township, TW;
Ming-Han Lee, Taipei, TW;
Hsin-Yen Huang, Yonghe, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
Semiconductor device metallization systems and methods are disclosed. In some embodiments, a metallization system for semiconductor devices includes a mainframe, and a plurality of modules disposed proximate the mainframe. One of the plurality of modules comprises a physical vapor deposition (PVD) module and one of the plurality of modules comprises an ultraviolet light (UV) cure module.