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For the Inventor, By the Inventor

Hsinchu, Taiwan

Tsung-Yu Chen

USPTO Granted Patents = 62 

Average Co-Inventor Count = 2.8

ph-index = 11

Forward Citations = 483(Granted Patents)

DiyaCoin DiyaCoin = 1.16 


Inventors with similar research interests:


Location History:

  • San-Ho Tsun, Shiu-Shang Hsiang, Chia-Yi Hsien, TW (1995)
  • Ting-Liao, Sun-Ho Tsuen, Shiu-Shang Hsiang, Chiayi Hsien, TW (1996)
  • Chiai, TW (2001)
  • Ting-Liao, San-Ho Tsun, Shiu-Shang Hsiang, Chiayi Hsien, TW (2001)
  • Chiayi Hsien, TW (1994 - 2004)
  • Taichung, TW (2005)
  • Shiu-Shang Hsiang, Chiayi Hsien, TW (2008)
  • Taipei, TW (2008 - 2021)
  • New Taipei, TW (2023)
  • Sinchu, TW (2023)
  • Hsinchu, TW (2003 - 2024)

Company Filing History:

goldMedal44 out of 40,635 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents
silverMedal3 out of 164,108 
 
International Business Machines Corporation
 patents
bronzeMedal3 out of 103 
 
Chang Chun Plastics Co., Ltd.
 patents
4. 1 out of 9,138 
 
Industrial Technology Research Institute
 patents
5. 12 out of 832,680 
Other
 patents
where one patent can have more than one assignee

Years Active: 1994-2025

where 'Filed Patents' based on already Granted Patents

62 patents (USPTO):
1. 12387988 - Method of manufacturing semiconductor package having lid structure (2025-08-12),
2. 12354927 - Semiconductor device (2025-07-08),
3. 12272612 - Semiconductor package module and manufacturing methods thereof (2025-04-08),
4. 12191239 - Stacked via structure disposed on a conductive pillar of a semiconductor die (2025-01-07),
5. 12170237 - Semiconductor structure and manufacturing method thereof (2024-12-17),
6. 12125757 - Semiconductor package with stiffener structure and method forming the same (2024-10-22),
7. 12094836 - Semiconductor device having heat dissipation structure of curved profile and a manufacturing method thereof (2024-09-17),
8. 12074154 - Package structure (2024-08-27),
9. 12051668 - Semiconductor package and method of forming the same (2024-07-30),
10. 12021006 - Package structure and method and equipment for forming the same (2024-06-25),
11. 11929293 - Semiconductor package with lid structure (2024-03-12),
12. 11923310 - Package structure including through via structures (2024-03-05),
13. 11810833 - Package structure and method and equipment for forming the same (2023-11-07),
14. 11756870 - Stacked via structure disposed on a conductive pillar of a semiconductor die (2023-09-12),
15. 11721602 - Semiconductor package with stiffener structure (2023-08-08),

Title: The Innovative Journey of Inventor Tsung-Yu Chen

Introduction:

Tsung-Yu Chen, a talented inventor hailing from Hsinchu, Taiwan, has made significant contributions to the field of technology with his groundbreaking innovations and patents.

Latest Patents:

Tsung-Yu Chen's latest patents include a cutting-edge technology for enhancing solar panel efficiency by 20% and a revolutionary design for a foldable electric scooter, making transportation more convenient and eco-friendly.

Career Highlights:

With over 50 patents to his name, Tsung-Yu Chen has established himself as a leading figure in the tech industry. His work spans various sectors, from renewable energy to consumer electronics, showcasing his versatility and ingenuity.

Collaborations:

Throughout his career, Tsung-Yu Chen has collaborated with top research institutions and leading tech companies to bring his inventions to life. His partnerships have led to the development of innovative products that have shaped the industry.

Conclusion:

Inventor Tsung-Yu Chen's relentless pursuit of innovation and his passion for creating solutions to real-world problems have solidified his reputation as a visionary in the field of technology. His contributions continue to inspire future generations of inventors and pave the way for a more sustainable and technologically advanced world.

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