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For the Inventor, By the Inventor

Hsinchu, Taiwan

Tsung-Jen Liao

This inventor holds 11 USPTO granted patents and 1 published patent application. Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Chipmos Technologies Inc.. Active years: 2015-2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tsung-Jen Liao. Retrieved from https://idiyas.com/inventor/tsung-jen-liao

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 11 

% Patents Active = 100.0

Average Co-Inventor Count = 1.8

ph-index = 2

Forward Citations = 7(Granted Patents)


Location History:

  • Hsinchu, TW (2015 - 2021)
  • Zhubei, TW (2020 - 2022)

Company Filing History:

goldMedal6 out of 42,872 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents
silverMedal5 out of 178 
 
Chipmos Technologies Inc.
 patents

Years Active: 2015-2024

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11 patents (USPTO):Explore Patents
1. 12159847 - Integrated fan-out structures and methods for forming the same (2024-12-03),
2. 11527499 - Integrated fan-out structures and methods for forming the same (2022-12-13),
3. 11164764 - Carrier tape system and methods of using carrier tape system (2021-11-02),
4. 11164763 - Carrier tape system and methods of using carrier tape system (2021-11-02),
5. 10879098 - Semiconductor chip holder (2020-12-29),
6. 10679877 - Carrier tape system and methods of using carrier tape system (2020-06-09),
7. 9437542 - Chip package structure (2016-09-06),
8. 9269643 - Chip package structure (2016-02-23),
9. 9196553 - Semiconductor package structure and manufacturing method thereof (2015-11-24),
10. 9123684 - Chip package structure and manufacturing method thereof (2015-09-01),
11. 9018772 - Chip structure and multi-chip stack package (2015-04-28),

Title: Tsung-Jen Liao: Innovator in Semiconductor Technology

Introduction

Tsung-Jen Liao is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 11 patents. His work focuses on innovative structures and methods that enhance the performance and reliability of semiconductor devices.

Latest Patents

One of Tsung-Jen Liao's latest patents is titled "Integrated fan-out structures and methods for forming the same." This patent discloses an integrated fan-out structure on a semiconductor die, along with methods for making and testing the semiconductor die. The semiconductor die features a bond pad with a hole formed in it, a passivation layer over a portion of the bond pad, and a protective layer covering the hole in the bond pad. This innovation aims to improve the efficiency and functionality of semiconductor devices.

Career Highlights

Throughout his career, Tsung-Jen Liao has worked with leading companies in the semiconductor industry, including Taiwan Semiconductor Manufacturing Company Ltd. and Chipmos Technologies Inc. His experience in these organizations has allowed him to develop cutting-edge technologies that push the boundaries of semiconductor design and manufacturing.

Collaborations

Some of Tsung-Jen Liao's notable coworkers include Pei-Haw Tsao and Tsui-Mei Chen. Their collaborative efforts have contributed to advancements in semiconductor technology and innovation.

Conclusion

Tsung-Jen Liao is a key figure in the semiconductor industry, with a strong portfolio of patents that reflect his innovative spirit. His contributions continue to shape the future of semiconductor technology, making him a notable inventor in this field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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