The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 09, 2020

Filed:

Mar. 28, 2019
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Tsung-Jen Liao, Zhubei, TW;

Pei-Haw Tsao, Tai-chung, TW;

Tsui-Mei Chen, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 13/02 (2006.01); B65H 5/28 (2006.01); H01L 21/67 (2006.01); H01L 21/683 (2006.01); C09J 7/20 (2018.01); H05K 13/00 (2006.01); H05K 13/04 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67132 (2013.01); C09J 7/201 (2018.01); H01L 21/6836 (2013.01); H05K 13/0084 (2013.01); C09J 2203/326 (2013.01); C09J 2205/302 (2013.01); H01L 2221/68313 (2013.01); H01L 2221/68354 (2013.01); H05K 13/0408 (2013.01); H05K 13/0419 (2018.08);
Abstract

The current disclosure describes carrier tape systems that include a carrier tape substrate and a cover tape. The carrier tape system includes a plurality of repetitive adhesion areas where the carrier tape substrate and cover tape are attached to each other and non-adhesion areas where the carrier tape substrate and cover tape are not attached to each other. Separating the cover tape and the carrier tape substrate at these repetitive adhesion and non-adhesion areas imparts a vibration to the cover tape which impedes or prevents semiconductor devices carried in pockets of the carrier tape substrate from adhering to adhesive on the cover tape.


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