St. James, MO, United States of America

Tony D Flaim

USPTO Granted Patents = 53 

 

Average Co-Inventor Count = 3.4

ph-index = 14

Forward Citations = 572(Granted Patents)

Forward Citations (Not Self Cited) = 535(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Rolla, MO (US) (1993)
  • St. James, MO (US) (1988 - 2020)

Company Filing History:

goldMedal49 out of 189 
 
Brewer Science, Inc.
 patents
silverMedal1 out of 16 
 
Lumimove, Inc.
 patents
bronzeMedal4 out of 832,843 
Other
 patents
where one patent can have more than one assignee

Years Active: 1988-2025

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Areas of Expertise:
Polymer Coatings
Wafer Bonding
Microelectronic Substrates
Photoresist Compositions
Anti-Reflective Coatings
Cyclic Olefin Compositions
Laser Ablative Materials
Nanoparticle Deposition
Thermosetting Polyester
High-Viscosity Bonding Layers
Radiation-Sensitive Materials
Intrinsic Light-Absorbing Polymers
53 patents (USPTO):Explore Patents

Title: The Innovations of Tony D Flaim: Pioneering Patents in Semiconductor Technology

Introduction: Tony D Flaim, a notable inventor based in St. James, Missouri, has made significant contributions to the field of semiconductor technology through his impressive portfolio of 52 patents. His works primarily focus on innovative processes and materials that enhance the performance and efficiency of electronic devices.

Latest Patents: Among Flaim's latest inventions is the "Polymer film stencil process for fan-out wafer-level packaging of semiconductor devices." This invention presents a stencil-based process for fan-out wafer-level packaging (FOWLP), addressing limitations in prior art over-molding of dies. The method involves using a temporary carrier coated with a release layer and curable adhesive backing. Through the lamination of a die stencil film and careful placement of dies into pre-formed cavities, the process ensures optimal filling of gaps with curable polymeric material, resulting in improved repeatability and reduced bowing in carriers.

Another noteworthy patent focuses on "Laser ablative dielectric material." Flaim introduces dielectric materials with superior mechanical properties suitable for laser ablation patterning. The proposed materials include polymers such as polyureas, polyurethane, and polyacylhydrazones, with new preparation methods that ensure stability at room temperature. These dielectric materials offer high elongation, low coefficient of thermal expansion (CTE), and minimal debris post-ablation, making them a valuable asset in microelectronics.

Career Highlights: Throughout his career, Tony D Flaim has demonstrated a relentless pursuit of innovation, solidifying his position as a leader in semiconductor technology. His work at Brewer Science, Inc. has particularly highlighted his expertise in developing processes that push the boundaries of current technology.

Collaborations: Flaim has collaborated with respected professionals in the field, including Terry Lowell Brewer and Rama Puligadda. Their collective efforts have contributed to developments that enhance the technological landscape, showcasing the power of collaboration in driving innovation.

Conclusion: Tony D Flaim's inventive spirit and dedication have led to significant advancements in semiconductor technologies. With a solid foundation of patents that address complex challenges in the industry, Flaim continues to inspire future innovations in electronics through his groundbreaking work. His contributions highlight not only his expertise but also the importance of continuous research and development in shaping the future of technology.

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