logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9827757 B1

PDFFull Text
Date of Patent:
Nov. 28, 2017

Filed:

Jul. 09, 2012

Methods of transferring device wafers or layers between carrier substrates and other surfaces

Applicants:

Jeremy Mccutcheon, Rolla, MO (US);

Tony D. Flaim, St. James, MO (US);

Susan Bailey, Rolla, MO (US);

Inventors:

Jeremy McCutcheon, Rolla, MO (US);

Tony D. Flaim, St. James, MO (US);

Susan Bailey, Rolla, MO (US);

Assignee:

Brewer Science Inc., Rolla, MO (US);

Attorney:

Hovey Williams LLP

Primary Examiner:

Sing P Chan

Int. Cl.
CPC ...
B29C 65/48 (2006.01); B32B 9/04 (2006.01); B32B 37/12 (2006.01); B32B 37/16 (2006.01); B32B 38/10 (2006.01); B32B 43/00 (2006.01); H01L 21/683 (2006.01); B32B 7/06 (2006.01); B32B 7/12 (2006.01); B32B 7/14 (2006.01); H01L 21/20 (2006.01);
U.S. Cl.
CPC ...
B32B 38/10 (2013.01); B32B 7/06 (2013.01); B32B 7/12 (2013.01); B32B 7/14 (2013.01); B32B 43/006 (2013.01); H01L 21/2007 (2013.01); H01L 21/6835 (2013.01); B32B 2457/14 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68318 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68368 (2013.01); H01L 2221/68381 (2013.01); Y10T 156/11 (2015.01); Y10T 428/24331 (2015.01); Y10T 428/24851 (2015.01); Y10T 428/30 (2015.01); Y10T 428/31598 (2015.04); Y10T 428/31667 (2015.04);
Abstract

New temporary bonding methods and articles formed from those methods are provided. In one embodiment, the methods comprise coating a device or other ultrathin layer on a growth substrate with a rigid support layer and then bonding that stack to a carrier substrate. The growth substrate can then be removed and the ultrathin layer mounted on a final support. In another embodiment, the invention provides methods of handling device layers during processing that must occur on both sides of the fragile layer without damaging it. This is accomplished via the sequential use of two carriers, one on each side of the device layer, bonded with different bonding compositions for selective debonding.

Find Patent Forward Citations

Loading…