Company Filing History:
Years Active: 2015-2017
Title: Innovations by Susan Bailey
Introduction
Susan Bailey is a prominent inventor based in Rolla, MO (US). She has made significant contributions to the field of microelectronics, holding 2 patents that showcase her innovative approaches to wafer bonding and handling.
Latest Patents
One of her latest patents focuses on methods of transferring device wafers or layers between carrier substrates and other surfaces. This invention introduces new temporary bonding methods and articles formed from those methods. In one embodiment, the methods involve coating a device or other ultrathin layer on a growth substrate with a rigid support layer, which is then bonded to a carrier substrate. The growth substrate can subsequently be removed, allowing the ultrathin layer to be mounted on a final support. Another embodiment provides methods for handling device layers during processing that must occur on both sides of the fragile layer without causing damage. This is achieved through the sequential use of two carriers, one on each side of the device layer, bonded with different bonding compositions for selective debonding.
Her second patent involves the development of a high-viscosity bonding layer through in-situ polymer chain extension. This invention presents new compositions and methods for using those compositions as bonding materials for temporary wafer bonding. The compositions are utilized to temporarily bond an active wafer to a carrier wafer or substrate in microelectronic fabrication. This process employs an in situ polymerization reaction of the bonding composition components to create a robust bonding layer. The resulting polymerized bonding layers are mechanically strong and thermally resistant, yet they allow for the separation of wafers at the appropriate stage in the fabrication process. Additionally, the bonding layer retains its solubility, enabling residue to be cleaned from debonded wafers using simple wet methods rather than harsh treatments.
Career Highlights
Susan Bailey is currently associated with Brewer Science, Inc., where she continues to innovate in the field of microelectronics. Her work has significantly impacted the efficiency and effectiveness of wafer bonding processes.
Collaborations
Some of her notable coworkers include Tony D Flaim and Wenbin Hong, who contribute to her innovative projects and research endeavors.
Conclusion
Susan Bailey's contributions to the field of microelectronics through her patents and work at Brewer Science, Inc. highlight her role as a leading inventor. Her innovative methods for wafer bonding and handling are paving the way for advancements in microelectronic fabrication.