The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 08, 2015
Filed:
Apr. 30, 2012
Wenbin Hong, Ballwin, MO (US);
Tony D. Flaim, St. James, MO (US);
Rama Puligadda, Rolla, MO (US);
Susan Bailey, Rolla, MO (US);
Wenbin Hong, Ballwin, MO (US);
Tony D. Flaim, St. James, MO (US);
Rama Puligadda, Rolla, MO (US);
Susan Bailey, Rolla, MO (US);
Brewer Science Inc., Rolla, MO (US);
Abstract
New compositions and methods of using those compositions as bonding compositions for temporary wafer bonding are provided. The compositions are used to temporarily bond an active wafer to a carrier wafer or substrate in microelectronic fabrication using an in situ polymerization reaction of the components of the bonding composition to yield the bonding layer. The compositions form polymerized bonding layers that are mechanically strong and thermally resistant, but allow the wafers to be separated at the appropriate stage in the fabrication process. The bonding layer also retains its solubility so that residue can be cleaned from the debonded wafers using simple wet methods rather than etching or other harsh treatments.