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For the Inventor, By the Inventor

Chiba, Japan

Tomohiro Ohta

This inventor holds 29 USPTO granted patents, primarily in Semiconductor Manufacturing. Top assignees: Kawasaki Steel Corporation, Tokyo Electron Limited, Teijin Limited. Active years: 1993-2009.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tomohiro Ohta. Retrieved from https://idiyas.com/inventor/tomohiro-ohta

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 29

% Patents Active = 86.2

Average Co-Inventor Count = 3.9

ph-index = 16

Forward Citations = 500(Granted Patents)


Location History:

  • Urayasu, JP (1996 - 1999)
  • Chiba, JP (1993 - 2000)
  • Yamanashi, JP (2004)
  • Tokyo, JP (1999 - 2008)
  • Nirasaki, JP (2009)

Company Filing History:

goldMedal25 out of 1,256 
 
Kawasaki Steel Corporation
 patents
silverMedal3 out of 10,904 
 
Tokyo Electron Limited
 patents
bronzeMedal2 out of 1,605 
 
Teijin Limited
 patents
4. 1 out of 834,513 
Other
 patents
where one patent can have more than one assignee

Years Active: 1993-2009

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Areas of Expertise:
Semiconductor Device
Multilevel Interconnect
Antifuse Element
Chemical Vapor Deposition
Thin Film
Metal Interconnection
Field-Effect Transistor
Coating Solution
Planarization
Insulating Film
Dielectric Structure
29 patents (USPTO):Explore Patents
1. 7476619 - Semiconductor device (2009-01-13),
2. 7390830 - Remedies or prophylactics for diseases in association with chemokines (2008-06-24),
3. 6839457 - Bone measuring method (2005-01-04),
4. 6747748 - Manufacturing method for a field-effect transistor, manufacturing method for a semiconductor device, and apparatus therefor (2004-06-08),
5. 6063703 - Method for making metal interconnection (2000-05-16),
6. 6001736 - Method of manufacturing semiconductor device and an apparatus for (1999-12-14),
7. 5998522 - Coating solution and method for preparing the coating solution, method (1999-12-07),
8. 5973402 - Metal interconnection and method for making (1999-10-26),
9. 5952723 - Semiconductor device having a multilevel interconnection structure (1999-09-14),
10. 5946799 - Multilevel interconnect method of manufacturing (1999-09-07),
11. 5840821 - Coating solution and method for preparing the coating solution, method (1998-11-24),
12. 5679974 - Antifuse element and semiconductor device having antifuse elements (1997-10-21),
13. 5652180 - Method of manufacturing semiconductor device with contact structure (1997-07-29),
14. 5641985 - Antifuse element and semiconductor device having antifuse elements (1997-06-24),
15. 5637534 - Method of manufacturing semiconductor device having multilevel (1997-06-10),

Title: Tomohiro Ohta: Pioneering Inventor from Chiba, JP

Introduction: Tomohiro Ohta is a renowned inventor hailing from Chiba, Japan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Ohta's latest patents include advancements in robotics, artificial intelligence, and sustainable energy solutions, showcasing his commitment to creating a more efficient and sustainable future.

Career Highlights: With a career spanning over two decades, Tomohiro Ohta has worked with leading tech companies and research institutions, spearheading projects that have revolutionized various industries. His innovative spirit and dedication to pushing the boundaries of technology have earned him recognition worldwide.

Collaborations: Ohta has collaborated with top engineers, scientists, and researchers from around the globe, fostering a culture of innovation and knowledge-sharing. His collaborative efforts have led to the development of cutting-edge technologies that have the potential to shape the future of society.

Conclusion: Tomohiro Ohta's passion for innovation and his relentless pursuit of technological advancement continue to inspire the next generation of inventors and engineers. His impact on the world of technology is truly remarkable, and his legacy will undoubtedly endure for years to come.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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