The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 07, 1999
Filed:
Dec. 18, 1996
Kawasaki Steel Corporation, Kobe, JP;
Abstract
In a multilevel interconnect structure for use in a semiconductor device including a lower metal wiring having an aluminum or aluminum alloy film and a high melting point metal or high melting metal alloy film, an interlayer insulating film deposited on the lower metal wiring, a via hole formed in the interlayer insulating film, a plug made of aluminum or aluminum alloy and formed in the via hole, and an upper metal wiring having an aluminum or aluminum alloy film and a high melting point metal or high melting point metal alloy film, said plug is directly contacted with the aluminum or aluminum alloy film of at least one of the lower and upper metal wirings to decrease the via resistance without reducing the electromigration reliability. The plug is formed such that its top portion protrudes from the interlayer insulating film, the high melting point metal or high melting point metal alloy film of the upper metal wiring is formed, and then the top portion of the plug is removed together with a part of the high melting point metal or high melting point metal alloy film by a chemical mechanical polishing to expose an upper end of the plug. Then, the aluminum or aluminum alloy film of the upper metal wiring is formed to be brought into direct contact with the plug.