Austin, TX, United States of America

Tingdong Zhou

This inventor holds 29 USPTO granted patents and 8 published patent applications, primarily in Semiconductor Packaging. Top assignees: International Business Machines Corporation, Nxp USA, Inc.. Active years: 2009-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tingdong Zhou. Retrieved from https://idiyas.com/inventor/tingdong-zhou

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 29 

% Patents Active = 51.7

Average Co-Inventor Count = 3.7

ph-index = 5

Forward Citations = 74(Granted Patents)


Company Filing History:


Years Active: 2009-2026

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Areas of Expertise:
Semiconductor Device
3D Chip Testing
Power Supply
Interconnection Design
Dielectric Crack Prevention
Electronic Module
Multi-Layer Circuit Board
High-Speed Ceramic Modules
Crosstalk Reduction
Hybrid Referencing
Power Domain Optimization
Package Pin Assignment
29 patents (USPTO):Explore Patents

Title: Innovations of Tingdong Zhou: Pioneering Semiconductor Technologies

Introduction

Tingdong Zhou, an accomplished inventor based in Austin, TX, has made significant contributions to the field of semiconductor technology. With a remarkable portfolio of 27 patents, he has played a pivotal role in advancing innovations that enhance the performance and reliability of semiconductor devices.

Latest Patents

Among his latest achievements are two groundbreaking patents that demonstrate his expertise and ingenuity. The first patent, titled "Device package substrate structure and method therefor," introduces a semiconductor device substrate that features an embedded trace substrate (ETS) portion. This innovative substrate incorporates a first conductive layer at a major surface, which is patterned to form a signal line. The careful arrangement of conductive and non-conductive layers optimizes the device’s performance.

The second patent, titled "3D chip testing through micro-C4 interface," presents a novel approach to testing semiconductor wafers with micro-solder connections. This method permits direct electrical probing of the micro-solder connections without relying on a testing interposer. Additionally, the invention includes an advanced probe tip structure designed to match the pitch of the micro-solder connections, illustrating Zhou's commitment to improving semiconductor testing methodologies.

Career Highlights

Throughout his career, Tingdong Zhou has worked with notable companies, including the International Business Machines Corporation (IBM) and NXP USA, Inc. His experiences at these prestigious organizations have equipped him with the knowledge and skills necessary to innovate within the semiconductor industry.

Collaborations

Tingdong has had the privilege of collaborating with talented coworkers, including Michael Anthony Christo and Julio Alejandro Maldonado. These partnerships have undoubtedly fostered a creative environment that encourages the exploration of innovative solutions in semiconductor technology.

Conclusion

In summary, Tingdong Zhou's impressive array of patents and his work with leading companies underscore his status as a prominent figure in semiconductor innovation. His latest patents, which focus on device substrate structures and testing methods, showcase his dedication to advancing technology in meaningful ways. With a solid foundation of collaborations and experiences, Zhou remains a significant contributor to the future of semiconductor advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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