The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 18, 2018

Filed:

May. 09, 2016
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Michael A. Christo, Round Rock, TX (US);

Julio A. Maldonado, Austin, TX (US);

Roger D. Weekly, Austin, TX (US);

Tingdong Zhou, Austin, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/02 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 1/112 (2013.01); H05K 1/0263 (2013.01); H05K 1/0296 (2013.01); H05K 1/115 (2013.01); H05K 3/3436 (2013.01); H05K 2201/0355 (2013.01); H05K 2201/1028 (2013.01); Y10T 29/49128 (2015.01); Y10T 29/49155 (2015.01);
Abstract

Power may be supplied to an electronic module according to various techniques. In one general implementation, for example, a system for supplying power to an electronic module may include a printed circuit board, the electronic module, and a conductive foil. The board may include a number of contact locations on a first side, with at least one of the contact locations electrically coupled to a via to a second side of the board. The electronic module may be electrically coupled to the contact locations on the first side of the board and receive electrical power through the at least one contact location electrically coupled to a via. The foil may be adapted to convey electrical power for the electronic module and electrically coupled on the second side of circuit board to at least the via electrically coupled to a contact location that receives electrical power for the electronic module.


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