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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10371717 B1

PDFFull Text
Date of Patent:
Aug. 06, 2019

Filed:

Aug. 08, 2017

3d chip testing through micro-c4 interface

Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Victor A. Garibay, Leander, TX (US);

Chetan Mehta, Austin, TX (US);

Doorlabh Panjwani, Bangalore, IN;

Tingdong Zhou, Austin, TX (US);

Assignee:

International Business Machines Corporation, Armonk, NY (US);

Attorney:

Scully, Scott, Murphy & Presser, P.C.

Primary Examiner:

David A Zarneke

Int. Cl.
CPC ...
G01R 1/067 (2006.01); G01R 1/073 (2006.01); G01R 31/26 (2014.01); H01L 21/66 (2006.01); H01L 23/00 (2006.01); H01L 23/48 (2006.01); H01L 25/065 (2006.01); G01R 31/3185 (2006.01);
U.S. Cl.
CPC ...
G01R 1/067 (2013.01); G01R 1/06738 (2013.01); G01R 1/07378 (2013.01); G01R 31/318513 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 25/0657 (2013.01); G01R 1/073 (2013.01); G01R 31/2601 (2013.01); H01L 22/14 (2013.01); H01L 22/30 (2013.01); H01L 22/32 (2013.01); H01L 22/34 (2013.01); H01L 23/481 (2013.01); H01L 2224/13014 (2013.01); H01L 2224/13016 (2013.01); H01L 2224/13025 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16225 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06596 (2013.01); H01L 2924/14 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/2064 (2013.01); H01L 2924/20641 (2013.01);
Abstract

Structures and methods for directly testing a semiconductor wafer having micro-solder connections. According to one embodiment, a method forms a pattern of micro-solder connections coupled with a through substrate via (TSV) that can be directly tested by electrical probing, without the use of a testing interposer. According to another embodiment, a method tests the pattern of micro-solder connections. According to another embodiment, a novel electrical probe tip structure has contacts on the same pitch as the pattern of micro-solder connections.

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