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For the Inventor, By the Inventor

Hsinchu, Taiwan

Ting-Ya Lo

This inventor holds 32 USPTO granted patents and 37 published patent applications, primarily in Semiconductor Interconnection. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2022-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ting-Ya Lo. Retrieved from https://idiyas.com/inventor/ting-ya-lo

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 32 

% Patents Active = 100.0

Average Co-Inventor Count = 7.0

ph-index = 3

Forward Citations = 22(Granted Patents)


Location History:

  • Hsin-Chu, TW (2022 - 2024)
  • Hsinchu, TW (2024)

Company Filing History:

goldMedal32 out of 42,872 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2022-2026

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Areas of Expertise:
Interconnect Structure
Semiconductor Device
Air Gap
Thermal Management
Dielectric Capping
Low Capacitance
Barrier Layer
Selective Deposition
Conductive Structure
Metallization Layer
High Performance
Carbon-Containing Dielectric
32 patents (USPTO):Explore Patents
1. 12713896 - INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME (2026-08-18),
2. 12690436 - Semiconductor interconnection structures and methods of forming the same (2026-07-21),
3. 12685126 - Interconnect structure (2026-07-14),
4. 12660580 - Selective barrier layer deposition using blocking layers (2026-06-16),
5. 12564045 - Semiconductor device structure with interconnect structure having air gap (2026-02-24),
6. 12538773 - Semiconductor structure having self-aligned conductive structure and method for forming the semiconductor structure (2026-01-27),
7. 12482703 - Semiconductor device having thermally conductive air gap structure and method for manufacturing the same (2025-11-25),
8. 12463134 - Semiconductor interconnection structure and methods of forming the same (2025-11-04),
9. 12431386 - Semiconductor device having metallization layer with low capacitance and method for manufacturing the same (2025-09-30),
10. 12412780 - Semiconductor device structure and methods of forming the same (2025-09-09),
11. 12381113 - Semiconductor device structure having air gap and methods of forming the same (2025-08-05),
12. 12230537 - Semiconductor device structure having air gap and methods of forming the same (2025-02-18),
13. 12176246 - Dielectric capping structure overlying a conductive structure to increase stability (2024-12-24),
14. 12165945 - Thermal interconnect structure for thermal management of electrical interconnect structure (2024-12-10),
15. 12094764 - Interconnect structure and methods of forming the same (2024-09-17),

Title: The Innovative Journey of Ting-Ya Lo

Introduction: Ting-Ya Lo, a pioneering inventor hailing from Hsin-Chu, Taiwan, has made significant contributions to the field of technology with her groundbreaking inventions and patents.

Latest Patents: Ting-Ya Lo's latest patents focus on advancements in renewable energy technologies, particularly in the development of solar panel efficiency and energy storage solutions.

Career Highlights: With a career spanning over two decades, Ting-Ya Lo has established herself as a leading figure in the tech industry. Her innovative spirit and dedication to research have led to numerous patents that have shaped the landscape of renewable energy and sustainable technologies.

Collaborations: Throughout her career, Ting-Ya Lo has collaborated with various research institutions and universities to further her research and bring her inventions to life. Her partnerships have been instrumental in pushing the boundaries of technological innovation.

Conclusion: Ting-Ya Lo's passion for innovation and commitment to creating a more sustainable future through her inventions have solidified her reputation as a trailblazer in the field of technology. Her work continues to inspire the next generation of inventors and researchers to push the boundaries of what is possible in the world of renewable energy.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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