Ting-Chen Hsu

Title: **Innovations of Inventor Ting-Chen Hsu**

Introduction

Ting-Chen Hsu is a notable inventor based in Taichung, Taiwan. With an impressive portfolio of 11 patents, he has made significant contributions to the field of integrated circuit technology. His inventions focus on enhancing the performance and reliability of semiconductor devices, which are critical for modern electronic applications.

Latest Patents

Among Ting-Chen Hsu's latest innovations are several patents that address substrate warpage in integrated chips. One of his notable patents is centered on a trench capacitor film scheme designed to reduce substrate warpage. The integrated chip described in this patent comprises a trench capacitor that includes capacitor electrode structures, warping reduction structures, and capacitor dielectric structures, all of which are layered to form a trench segment extending into the substrate. This design aims to improve the stability and functionality of the integrated circuit.

Another remarkable patent by Hsu focuses on the profile of the trench capacitor, which aims to decrease substrate warpage as well. This invention outlines an integrated chip that features a capacitor composed of multiple conductive and dielectric layers. The innovative design involves a base structure and a protrusion structure extending toward the substrate, which includes surfaces defining a cavity for optimized performance.

Career Highlights

Ting-Chen Hsu is an employee at Taiwan Semiconductor Manufacturing Company Limited, where he has contributed to semiconductor innovation and development. His dedication to advancing technology in semiconductors has positioned him as a key player in the industry.

Collaborations

Throughout his career, Hsu has collaborated with talented colleagues, including Jyun-Ying Lin and Chun-Yao Ko. Together, they have combined their expertise to enhance the research and development efforts at their organization, leading to groundbreaking patents in semiconductor technology.

Conclusion

Ting-Chen Hsu's work and inventions have had a profound impact on the semiconductor industry, particularly in addressing substrate warpage in integrated circuits. His continuous efforts in innovation exemplify the spirit of creativity and engineering excellence that drive advancements in technology. As Hsu continues to push the boundaries of semiconductor design, he remains a pivotal figure in the realm of inventors and innovations.