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Tamotsu Kitamura

This inventor holds 11 USPTO granted patents. Top assignee: Shinko Electric Industries Co., Ltd.. Active years: 2003-2010.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tamotsu Kitamura. Retrieved from https://idiyas.com/inventor/tamotsu-kitamura

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

USPTO Granted Patents = 11

% Patents Active = 36.4

Average Co-Inventor Count = 1.3

ph-index = 4

Forward Citations = 39(Granted Patents)

Location History:

Setagaya-Nagano, JP (2008)
Nagano, JP (2003 - 2010)

Company Filing History:

11 out of 1,704

Shinko Electric Industries Co., Ltd.

Years Active: 2003-2010

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11 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 7673269 - Automatic trace determination apparatus and method (2010-03-02),

2. 7627846 - Method and apparatus for automatically shaping traces on surface of substrate of semiconductor package by using computation (2009-12-01),

3. 7607113 - Wiring pattern determination method and computer program product thereof (2009-10-20),

4. 7546569 - Automatic trace determination method (2009-06-09),

5. 7543263 - Automatic trace shaping method (2009-06-02),

6. 7496878 - Automatic wiring method and apparatus for semiconductor package and automatic identifying method and apparatus for semiconductor package (2009-02-24),

7. 7469397 - Automatic trace determination method and apparatus for automatically determining optimal trace positions on substrate using computation (2008-12-23),

8. 7454736 - Automatic trace determination apparatus and computer program thereof (2008-11-18),

9. 7191415 - Clearance inspection apparatus and clearance inspection method (2007-03-13),

10. 6662351 - Wiring editing method, for semiconductor package, capable of easily editing offset of wiring pattern (2003-12-09),

11. 6596549 - Automatic wiring method for semiconductor package enabling design of high-speed wiring for semiconductor package with reduced labor (2003-07-22),

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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