Shinko Electric Industries Co., Ltd.

Tamotsu Kitamura

Norihide Hanami

Takayuki Nagasaki

Hiroyuki Sakai

Takahide Ichimura

Automatic trace determination apparatus comprises: means for setting candidate starting route and candidate ending routes that are tangent to an obstacle existing on a straight line connecting between a starting point and an end point of a trace; means for, when a plurality of obstacles exist on the straight line, setting, with respect to each pair of two of the obstacles, straight routes, each of which is tangent only to such two obstacles and does not intersect with any obstacle other than such two obstacles; means for setting tentative routes, each of which includes any one of the candidate starting routes and any one of the candidate ending routes and, when the plurality of obstacles exist, may further include any of candidate intermediate routes selected with respect to each pair of the obstacles; and means for, among the tentative routes, determining the tentative route that has the shortest distance between the starting point and the end point as an optimal trace route.

Automatic trace determination apparatus and method

A method and an apparatus for automatically shaping traces by using computation comprises: setting means that sets an equiangular octagon circumscribing a clearance circle indicating a position where clearance can be secured from vias so that one side of such equiangular octagon is in parallel with a reference line; setting means that sets, with respect to the existing trace having a segment passing between the vias, an equiangular octagon circumscribing a circle that is centered on a center position of the via in the closest vicinity of such segment and that is tangent to such segment so that one side of such equiangular octagon is in parallel with the reference line; correction means that corrects the existing trace in the vicinity of the via so that the trace overlaps any side of the equiangular octagon set with respect to such via; and correction means that connects two segments obtained by the correction means by a segment in a direction of '45&#xd7;n' degrees with respect to the reference line.

Method and apparatus for automatically shaping traces on surface of substrate of semiconductor package by using computation

A wiring pattern determination method and a computer program thereof comprise a step of moving positions of tentatively designed plated leads on an edge of a semiconductor package to the positions that can be accommodated in positionable windows nearest to the respective tentatively designed plated lead positions, in a template in which the positionable windows are arranged, so that the positionable windows have a predetermined pitch in a row direction corresponding to an identical layer of a multi-layered structure and so that the positionable windows are positioned at least in every other row in a column direction corresponding to a lamination direction of the multi-layered structure and, then, determining the moved positions as optimal positions of the plated leads.

Wiring pattern determination method and computer program product thereof

An automatic trace determination process comprises the steps of: determining whether an inspection line connecting between two points that are to be a starting point and an end point intersects with other traces or not; when the inspection line intersects with other traces, determining a straight line section connecting between the starting point and either one of terminal points of one of such other traces that exists in the nearest position to the starting point as a segment that constitutes a candidate of the optimal route; and resetting the terminal point used for determining the candidate of the optimal route when said inspection line intersects with the other traces as a new starting point, wherein, based on inspection lines that are newly drawn between the end point and such new starting points, the processes in these steps are further performed to generate the candidate constituted by the segments.

Automatic trace determination method

An automatic trace shaping method comprises the steps of: setting sets of coaxial equiangular octagons each having sides parallel with a predetermined reference line; performing a process for tentatively disposing the traces each having segments passing between the adjacent vias so that such segments overlap any sides of the equiangular octagons that are set for the vias existing at positions nearest to such segments sequentially for each trace so that at least clearance can be secured from the trace for which the process has been completed immediately before; and performing a process for further correcting positions of the tentatively disposed traces that cannot secure the clearance from the other adjacent tentatively disposed traces so that at least the clearance can be secured from such other tentatively disposed traces sequentially in an order inverse to that in the tentative disposition process for the traces.

Automatic trace shaping method

A semiconductor package automatic wiring apparatus which determines an optimum wiring route from each pad to a corresponding one of vias on a semiconductor package having a multi-tier bonding pad structure in which pads to be connected to a semiconductor chip are arranged in multiple rows, comprises: row identifying means for identifying each pad as to which row the pad belongs to; tentative placement means for mapping the position of the pad to a position on a matrix table after the pad has been identified by the row identifying means as to which row the pad belongs to; and determining means for determining the optimum wiring route based on the matrix table generated by the tentative placement means.

Automatic wiring method and apparatus for semiconductor package and automatic identifying method and apparatus for semiconductor package

An automatic trace determination apparatus for automatically determining optimal positions of traces from pads to corresponding vias on a substrate using computation comprises: tentative determination means for tentatively determining a tentative target line with which tentative positions of bending points of traces are aligned; and final determination means for determining a final target line by correcting the tentative target line so that at least clearances between the adjacent traces and between the traces and vias adjacent to the corresponding traces can be secured, wherein the positions of intersection of the determined final target line and the traces from the pads are determined as bending points of the traces.

Automatic trace determination method and apparatus for automatically determining optimal trace positions on substrate using computation

An automatic trace determination apparatus comprises: first means that performs a first process sequentially for all intersections formed between tentative traces connecting between pads and corresponding vias, wherein the first process determines distances from an intersection formed between two tentative traces to the corresponding vias, respectively, and allows one of the two tentative traces associated with the longer distance to bypass the via, with which the other of the two tentative traces associated with the shorter distance is connected; and second means that performs a second process sequentially for all intersections formed between the interim traces themselves or between the interim and tentative traces, wherein the second process determines distances from an intersection to the vias corresponding to the interim or tentative traces, respectively, and allows one of the two tentative or interim traces associated with the longer distance to bypass the via, with which the other of the two tentative or interim traces associated with the shorter distance is connected, and defines this bypass trace as an optimal trace.

Automatic trace determination apparatus and computer program thereof

A clearance inspection apparatus for inspecting clearance of a wiring line passing between vias on a substrate comprises: first determining means for determining vias adjacent on both sides of a reference via as first adjacent vias, the reference via and the first adjacent vias belonging to a first via row, wherein the reference via serves as a reference in clearance inspection; second determining means for determining vias adjacent to the first adjacent vias as second adjacent vias, the second adjacent vias belonging to a second via row which is adjacent to the first via row; and third determining means for determining a via located between the second adjacent vias as an inspection target via, wherein the clearance inspection apparatus inspects the clearance of the wiring line passing between the reference via and the inspection target via.

Clearance inspection apparatus and clearance inspection method

A wiring editing method for a semiconductor package of this invention includes the steps of assuming virtual circular arcs R to R in consideration of a clearance around a predetermined via in a designated area on a virtual plane, drawing a regular polygon circumscribing each of the virtual circular arcs R to R drawing a tangent from a via crossed by one of the virtual circular arcs R to R to the crossing virtual circular arc and connecting to the regular polygon circumscribing the crossing virtual circular arc to thereby form a wiring pattern and moving or omitting redundant line segments forming the regular polygon in the wiring pattern to change a wiring route when an offset occurs in the wiring pattern passing between the vias inside the designated area.

Wiring editing method, for semiconductor package, capable of easily editing offset of wiring pattern

An automatic wiring method for a semiconductor package includes: a provisional wiring step for sequentially specifying a plurality of lines of the terminals from the innermost periphery to the outermost periphery of bonding pads, connecting the bonding pads to predetermined vias present on the specified line of the terminal with line segments, and provisionally determining a wiring route for each line of the terminal such that the line segment passes through between the vias in each line of the terminal at equal intervals; and a wiring formation step for forming the wiring based on a design rule such that the wiring pattern passes through between the lines of the terminals with uniform intervals between wires based on the provisionally wired wiring routes.

Growing community of inventors

Nagano, Japan

Tamotsu Kitamura