Ogaki, Japan

Takeshi Furusawa


Average Co-Inventor Count = 2.7

ph-index = 3

Forward Citations = 28(Granted Patents)


Location History:

  • Gifu, JP (2013)
  • Ogaki, JP (2013 - 2018)

Company Filing History:


Years Active: 2013-2018

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13 patents (USPTO):Explore Patents

Title: Innovations of Takeshi Furusawa

Introduction

Takeshi Furusawa is a prominent inventor based in Ogaki, Japan. He has made significant contributions to the field of printed wiring boards, holding a total of 13 patents. His work has advanced the technology used in electronic components, showcasing his expertise and innovative spirit.

Latest Patents

Furusawa's latest patents include a printed wiring board that features a resin insulating layer with recess portions on its first surface. This design incorporates a first conductor layer within the recesses, which includes pads for mounting electronic components. Additionally, conductive pillars are formed on the pads to facilitate the mounting process. The second conductor layer is positioned on the opposite side of the resin insulating layer, and a via conductor connects both layers. His other patent details a printed wiring board that consists of two circuit boards laminated together, with specific thickness ratios to enhance performance.

Career Highlights

Furusawa is currently employed at Ibiden Company Limited, where he continues to innovate in the field of electronics. His work has been instrumental in developing advanced printed wiring technologies that are essential for modern electronic devices.

Collaborations

Some of his notable coworkers include Toshiki Furutani and Kota Noda, who have collaborated with him on various projects within the company.

Conclusion

Takeshi Furusawa's contributions to the field of printed wiring boards exemplify his dedication to innovation and technology. His patents reflect a deep understanding of electronic components and their applications, making him a valuable asset in the industry.

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