The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 18, 2017

Filed:

Mar. 31, 2015
Applicant:

Ibiden Co., Ltd., Ogaki-shi, JP;

Inventors:

Toru Furuta, Ogaki, JP;

Takeshi Furusawa, Ogaki, JP;

Tomoya Terakura, Ogaki, JP;

Assignee:

IBIDEN CO., LTD., Ogaki-shi, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 3/40 (2006.01); H05K 1/02 (2006.01); H05K 3/00 (2006.01); H05K 3/28 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4007 (2013.01); H05K 1/111 (2013.01); H05K 1/0271 (2013.01); H05K 3/0097 (2013.01); H05K 3/282 (2013.01); H05K 3/3436 (2013.01); H05K 2201/0355 (2013.01); H05K 2201/0376 (2013.01); H05K 2201/09745 (2013.01); H05K 2201/09772 (2013.01); H05K 2203/0369 (2013.01); H05K 2203/1536 (2013.01); Y02P 70/611 (2015.11); Y10T 29/49165 (2015.01);
Abstract

A method for manufacturing a printed wiring board with conductive posts includes forming on a first foil provided on carrier a first conductive layer including mounting pattern to connect electronic component via conductive posts, forming on the first foil a laminate including an insulating layer and a second foil to form the laminate on the first conductive layer, removing the carrier, forming a metal film on the laminate and first film, forming resist on the metal film to have pattern exposing portion of the metal film corresponding to the mounting pattern and portion of the second foil for a second conductive layer, forming an electroplating layer on the portion of the metal film not covered by the resist, removing the resist, and applying etching to remove the first and second foils below the metal film exposed by the removing the resist and to form the posts on the mounting pattern.


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