The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 22, 2018

Filed:

Feb. 16, 2016
Applicant:

Ibiden Co., Ltd., Ogaki-shi, JP;

Inventors:

Takayuki Katsuno, Ogaki, JP;

Yuki Ito, Ogaki, JP;

Takeshi Furusawa, Ogaki, JP;

Takema Adachi, Ogaki, JP;

Assignee:

IBIDEN CO., LTD., Ogaki-shi, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/02 (2006.01); H05K 3/00 (2006.01); H05K 3/24 (2006.01); H05K 3/02 (2006.01); H05K 3/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0271 (2013.01); H05K 3/007 (2013.01); H05K 3/244 (2013.01); H05K 3/025 (2013.01); H05K 3/188 (2013.01); H05K 2201/0338 (2013.01); H05K 2201/0344 (2013.01); H05K 2201/098 (2013.01); H05K 2203/1184 (2013.01);
Abstract

A printed wiring board includes a resin insulating layer having recess portions formed on first surface, a first conductor layer formed in the recess portions and including pads positioned to mount an electronic component, conductive pillars formed on the pads, respectively, and formed to mount the electronic component onto the resin insulating layer, a second conductor layer formed on second surface of the resin insulating layer on the opposite side with respect to the first surface, and a via conductor formed in the resin insulating layer such that the via conductor is penetrating through the resin insulating layer and connecting the first and second conductor layers. The pillars is formed such that each of the pads has an exposed surface exposed from a respective one of the conductive pillars, and the pads are formed such that the exposed surface is recessed from the first surface of the resin insulating layer.


Find Patent Forward Citations

Katsuno, Takayuki. (2018). Printed wiring board (U.S. Patent No. 9980371). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9980371

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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