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For the Inventor, By the Inventor

Tokyo, Japan

Takashi Mitsuya

USPTO Granted Patents = 15 

 

Average Co-Inventor Count = 3.9

ph-index = 1

Forward Citations = 13(Granted Patents)


Company Filing History:

goldMedal15 out of 2,508 
 
Ebara Corporation
 patents

Years Active: 2011-2025

where 'Filed Patents' based on already Granted Patents

15 patents (USPTO):
1. 12237194 - Substrate transporter and substrate processing apparatus including substrate transporter (2025-02-25),
2. 11911868 - Substrate processing apparatus, substrate processing method, and storage medium that stores program to cause computer in substrate processing apparatus to execute substrate processing method (2024-02-27),
3. 11177147 - Substrate treatment apparatus, controller of substrate treatment apparatus, method for controlling substrate treatment apparatus, and memory medium storing program (2021-11-16),
4. 11099546 - Scheduler, substrate processing apparatus, and substrate conveyance method (2021-08-24),
5. 11098414 - Plating system, a plating system control method, and a storage medium containing a program for causing a computer to execute the plating system control method (2021-08-24),
6. 10824138 - Scheduler, substrate processing apparatus, and substrate conveyance method (2020-11-03),
7. 10824135 - Scheduler, substrate processing apparatus, and substrate conveyance method (2020-11-03),
8. 10501862 - Plating system, a plating system control method, and a storage medium containing a program for causing a computer to execute the plating system control method (2019-12-10),
9. 10141211 - Substrate processing apparatus and substrate transfer method (2018-11-27),
10. 9786532 - Substrate processing apparatus and method of transferring a substrate (2017-10-10),
11. 8550875 - Method of operating substrate processing apparatus and substrate processing apparatus (2013-10-08),
12. 8398811 - Polishing apparatus and polishing method (2013-03-19),
13. 8202139 - Method of operating substrate processing apparatus and substrate processing apparatus (2012-06-19),
14. 8128458 - Polishing apparatus and substrate processing method (2012-03-06),
15. 8025759 - Polishing apparatus and polishing method (2011-09-27),

Title: The Innovative Contributions of Takashi Mitsuya

Introduction

Takashi Mitsuya is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of substrate processing technology, holding a total of 15 patents. His work focuses on improving the efficiency and accuracy of substrate handling and processing.

Latest Patents

Mitsuya's latest patents include a substrate transporter and a substrate processing apparatus that incorporates this transporter. The substrate conveying apparatus is designed to automate the process of conveying rectangular substrates. It features a series of conveyance rollers, roller shafts, a motor, and a pusher mechanism. This innovative design allows for the effective lifting and separation of substrates from the rollers. Additionally, his substrate processing apparatus enhances the accuracy of detecting when a substrate flies out of a polishing head. This apparatus includes a polishing table, a polishing head, and a slip-out detector that monitors the turning torque of the arm based on fluid flow rates.

Career Highlights

Mitsuya has built a successful career at Ebara Corporation, where he has been instrumental in developing advanced substrate processing technologies. His expertise in this area has led to numerous innovations that have improved manufacturing processes in various industries.

Collaborations

Some of his notable coworkers include Ryuya Koizumi and Kunio Oishi, who have collaborated with him on various projects within Ebara Corporation.

Conclusion

Takashi Mitsuya's contributions to substrate processing technology exemplify his innovative spirit and dedication to advancing the field. His patents reflect a commitment to improving efficiency and accuracy in manufacturing processes.

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