The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 27, 2011
Filed:
Jul. 01, 2004
Tatsuya Sasaki, Tokyo, JP;
Naoshi Yamada, Tokyo, JP;
Yoshifumi Katsumata, Tokyo, JP;
Noburu Shimizu, Tokyo, JP;
Seiryo Tsuno, Tokyo, JP;
Takashi Mitsuya, Tokyo, JP;
Tatsuya Sasaki, Tokyo, JP;
Naoshi Yamada, Tokyo, JP;
Yoshifumi Katsumata, Tokyo, JP;
Noburu Shimizu, Tokyo, JP;
Seiryo Tsuno, Tokyo, JP;
Takashi Mitsuya, Tokyo, JP;
Ebara Corporation, Tokyo, JP;
Abstract
A polishing apparatus has a polishing section () configured to polish a substrate and a measurement section () configured to measure a thickness of a film formed on the substrate. The polishing apparatus also has an interface () configured to input a desired thickness of a film formed on a substrate to be polished and a storage device () configured to store polishing rate data on at least one past substrate therein. The polishing apparatus includes an arithmetic unit () operable to calculate a polishing rate and an optimal polishing time based on the polishing rate data and the desired thickness by using a weighted average method which weights the polishing rate data on a lately polished substrate.