Company Filing History:
Years Active: 2011-2013
Title: Seiryo Tsuno: Innovator in Polishing Technology
Introduction
Seiryo Tsuno is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of polishing technology, holding 2 patents that showcase his innovative approach to improving polishing apparatuses.
Latest Patents
His latest patents include a polishing apparatus and polishing method designed to enhance the efficiency and accuracy of substrate polishing. The apparatus features a polishing section configured to polish a substrate and a measurement section that measures the thickness of a film formed on the substrate. It also includes an interface for inputting a desired thickness and a storage device that retains polishing rate data from past substrates. An arithmetic unit calculates the polishing rate and optimal polishing time using a weighted average method, which prioritizes data from recently polished substrates.
Career Highlights
Seiryo Tsuno is currently employed at Ebara Corporation, where he continues to develop innovative solutions in polishing technology. His work has significantly impacted the industry, leading to advancements in the efficiency of polishing processes.
Collaborations
He collaborates with talented coworkers, including Tatsuya Sasaki and Naoshi Yamada, who contribute to the innovative environment at Ebara Corporation.
Conclusion
Seiryo Tsuno's contributions to polishing technology through his patents and work at Ebara Corporation highlight his role as a key innovator in the field. His advancements continue to influence the industry and improve polishing methods.