Ebara Corporation

Seiryo Tsuno

Tatsuya Sasaki

Noburu Shimizu

Takashi Mitsuya

Naoshi Yamada

Yoshifumi Katsumata

A polishing apparatus has a polishing section () configured to polish a substrate and a measurement section () configured to measure a thickness of a film formed on the substrate. The polishing apparatus also has an interface () configured to input a desired thickness of a film formed on a substrate to be polished and a storage device () configured to store polishing rate data on at least one past substrate therein. The polishing apparatus includes an arithmetic unit () operable to calculate a polishing rate and an optimal polishing time based on the polishing rate data and the desired thickness by using a weighted average method which weights the polishing rate data on a lately polished substrate.

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Tokyo, Japan

Seiryo Tsuno