Company Filing History:
3 out of 2,514 
1 out of 52,766 
Years Active: 2011-2013
Title: Innovations by Yoshifumi Katsumata
Introduction
Yoshifumi Katsumata is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of polishing apparatus technology, holding three patents to his name. His work focuses on enhancing the efficiency and precision of substrate polishing processes.
Latest Patents
Katsumata's latest patents include a polishing apparatus and a polishing method. The polishing apparatus features a polishing section designed to polish a substrate and a measurement section that measures the thickness of a film formed on the substrate. It also includes an interface for inputting a desired thickness and a storage device for retaining polishing rate data from past substrates. An arithmetic unit calculates the polishing rate and optimal polishing time using a weighted average method based on the latest polishing data. Another patent, the substrate polishing apparatus, aims to prevent excessive and insufficient polishing while allowing for a quantitative setting of additional polishing time. This apparatus comprises a mechanism for polishing, a film thickness measuring device, an interface for entering target thickness, a storage area for past results, and a processing unit for calculating polishing time and rate.
Career Highlights
Throughout his career, Yoshifumi Katsumata has worked with prominent companies such as Ebara Corporation and Toshiba Corporation. His experience in these organizations has contributed to his expertise in polishing technologies and innovations.
Collaborations
Katsumata has collaborated with notable colleagues, including Tatsuya Sasaki and Naoshi Yamada. Their combined efforts have further advanced the development of polishing apparatus technologies.
Conclusion
Yoshifumi Katsumata's contributions to polishing apparatus technology demonstrate his innovative spirit and commitment to improving substrate polishing processes. His patents reflect a deep understanding of the technical challenges in this field and offer solutions that enhance efficiency and precision.