The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 05, 2013
Filed:
Feb. 05, 2010
Hidetaka Nakao, Tokyo, JP;
Yasumitsu Kawabata, Tokyo, JP;
Yoshifumi Katsumata, Tokyo, JP;
Naoki Ozawa, Tokyo, JP;
Tatsuya Sasaki, Tokyo, JP;
Atsushi Shigeta, Kanagawa-ken, JP;
Hidetaka Nakao, Tokyo, JP;
Yasumitsu Kawabata, Tokyo, JP;
Yoshifumi Katsumata, Tokyo, JP;
Naoki Ozawa, Tokyo, JP;
Tatsuya Sasaki, Tokyo, JP;
Atsushi Shigeta, Kanagawa-ken, JP;
Ebara Corporation, Tokyo, JP;
Kabushiki Kaisha Toshiba, Tokyo, JP;
Abstract
A substrate polishing apparatus is provided for preventing excessive polishing and insufficient polishing, and enabling a quantitative setting of an additional polishing time. The substrate polishing apparatus comprises a mechanism for polishing a substrate to be polished; a film thickness measuring device for measuring the thickness of a thin film deposited on the substrate; an interface for entering a target thickness for the polished thin film; a storage area for preserving past polishing results; and a processing unit for calculating a polishing time and a polishing rate. The substrate polishing apparatus builds an additional polishing database for storing data acquired from the result of additional polishing in the storage area.