Ebara Corporation

Takashi Mitsuya

Ryuya Koizumi

Kunio Oishi

Toshio Yokoyama

Kenichi Kobayashi

Kenichi Akazawa

Koji Nonobe

Masashi Shimoyama

Tatsuya Sasaki

Masahiko Sekimoto

Hiroyuki Kaneko

Noburu Shimizu

Asagi Matsugu

Hiroomi Torii

Keiichi Kurashina

Akihiro Yazawa

Naoshi Yamada

Takamasa Nakamura

Hiroaki Nishida

Yoshifumi Katsumata

Misao Date

Seiryo Tsuno

Tetsuji Togawa

Makoto Kashiwagi

Kenichiro Saito

Masanori Sasaki

Takahiro Nanjo

Hideharu Aoyama

Fong-Jie Du

Ayumu Saito

Takashi Koba

To provide an automated apparatus for conveying a rectangular substrate. According to one embodiment, there is provided a substrate conveying apparatus for conveying the rectangular substrate. The substrate conveying apparatus includes a plurality of conveyance rollers, a plurality of roller shafts, a motor, and a pusher. The plurality of conveyance rollers are configured to support a lower surface of the substrate. To the plurality of roller shafts, the plurality of conveyance rollers are mounted. The motor is configured to rotate the plurality of roller shafts. The pusher is for lifting the substrate on the plurality of conveyance rollers such that the substrate is separated away from the plurality of conveyance rollers. The pusher includes a stage configured to pass through a clearance between the plurality of roller shafts.

Substrate transporter and substrate processing apparatus including substrate transporter

Accuracy of detection of a fly out of a substrate from a polishing head is improved. A substrate processing apparatus includes a polishing tableto which a polishing padfor polishing the substrate is attachable, a polishing headfor holding and pressing the substrate against the polishing pad, a retainer member disposed surrounding the polishing head, a retainer member pressurization chamber disposed adjacent to the retainer member, an armfor holding and turning the polishing head, and a slip out detectorfor detecting a fly out of the substrate from the polishing headbased on a turning torque of the armor based on a flow rate of a fluid supplied to the retainer member pressurization chamber.

Substrate processing apparatus, substrate processing method, and storage medium that stores program to cause computer in substrate processing apparatus to execute substrate processing method

A substrate treatment apparatus includes a plurality of treatment chambers performing different treatment types on a substrate; a transfer device; and a controller that controls the transfer of the substrate and the substrate treatment. The controller enables fixation of a time for pulling up the substrate for each treatment chambers/treatment type and creation of a transfer schedule for transferring the substrate among the plurality of treatment chambers/treatment types and treating the substrate so as to maximize throughput, and enables correction of the transfer schedule to extend, based on a waiting time of the transfer device after storage of the substrate into a treatment chamber of one treatment type and a waiting time of the treatment chamber after treatment of the substrate, a time required for pulling up the substrate from a treatment chamber of an immediately previous treatment type in transfer order of the substrate.

Substrate treatment apparatus, controller of substrate treatment apparatus, method for controlling substrate treatment apparatus, and memory medium storing program

A plating system comprising a plating tank for applying plate processing to a substrate, a sensor configured to measure actual plating film thickness of the substrate, and a controller configured to control plating current supplied to the plating tank and plating time for the plate processing of the substrate within the plating tank. The controller is capable of setting target plating film thickness, plating current, and plating time as a plate processing recipe. At least one of the plating current and the plating time is automatically corrected so that the actual plating film thickness and the target plating film thickness become equal to each other, and the result is reflected in the plate processing for the subsequent substrate.

Plating system, a plating system control method, and a storage medium containing a program for causing a computer to execute the plating system control method

A calculation amount and calculation time for a substrate conveyance schedule are reduced. A scheduler is provided which is incorporated in a control section of a substrate processing apparatus including a plurality of substrate processing sections that process a substrate, a conveyance section that conveys the substrate, and the control section that controls the conveyance section and the substrate processing sections, and calculates a substrate conveyance schedule. The scheduler includes: a modeling section that models processing conditions, processing time and constraints of the substrate processing apparatus into nodes and edges using a graph network theory, prepares a graph network, and calculates a longest route length to each node; and a calculation section that calculates the substrate conveyance schedule based on the longest route length.

Scheduler, substrate processing apparatus, and substrate conveyance method

A substrate processing apparatus comprises a transferring device including a grasping section configured to grasp a substrate holder, and a transferring section configured to transfer the substrate holder grasped by the grasping section, and a processing bath for storing a substrate held by the substrate holder so that a surface of the substrate is vertically oriented, and processing the substrate. The grasping section is configured to grasp the substrate holder with a surface of the substrate oriented horizontally. The transferring section is configured to transfer the substrate holder above the processing bath, with the surface of the substrate oriented horizontally.

Substrate processing apparatus and substrate transfer method

A substrate processing apparatus is described herein. The substrate processing apparatus comprises a transferring device including: a grasping section configured to grasp a substrate holder, a transferring section configured to transfer the substrate holder grasped by the grasping section, and a processing bath for storing a substrate held by the substrate holder so that a surface of the substrate is vertically oriented. The grasping section is configured to grasp the substrate holder with a surface of the substrate oriented horizontally. The transferring section is configured to transfer the substrate holder above the processing bath, with the surface of the substrate oriented horizontally.

Substrate processing apparatus and method of transferring a substrate

A method of operating a substrate processing apparatus, upon the occurrence of a nonfatal failure in the apparatus, makes it possible to continue part of the apparatus operations for substrates to clean and recover a substrate or to easily discharge a substrate from the apparatus, without stopping an entire apparatus, thereby reducing the risk of a substrate becoming unprocessable. The method of operating a substrate processing apparatus having a polishing section, a cleaning section and a transferring mechanism, includes: classifying substrates, upon detection of a malfunction in any of the polishing section, the cleaning section and the transferring mechanism, according to the site of the malfunction and to the positions of the substrates in the substrate processing apparatus; and carrying out an operation for each of the substrates after the detection of the malfunction, the operation varying depending on the classification of the substrate.

Method of operating substrate processing apparatus and substrate processing apparatus

A polishing apparatus has a polishing section () configured to polish a substrate and a measurement section () configured to measure a thickness of a film formed on the substrate. The polishing apparatus also has an interface () configured to input a desired thickness of a film formed on a substrate to be polished and a storage device () configured to store polishing rate data on at least one past substrate therein. The polishing apparatus includes an arithmetic unit () operable to calculate a polishing rate and an optimal polishing time based on the polishing rate data and the desired thickness by using a weighted average method which weights the polishing rate data on a lately polished substrate.

Polishing apparatus and polishing method

A polishing apparatus detects the escape of a substrate from a top ring during polishing. The polishing apparatus includes a polishing table having a polishing pad, a top ring, and a substrate escape detection section for detecting escape of the substrate from the top ring. The detection section includes a light irradiation member for irradiating an area of the upper surface of the polishing pad with light, a controller for controlling the light irradiation of the light irradiation member, an image-taking member for taking an image of the area irradiated with the light, and an information processing member for processing information outputted from the image-taking member. The controller controls the light irradiation member in such a manner that it performs light irradiation at least for a period of time during which the substrate is regarded as being in contact with the polishing pad.

Polishing apparatus and substrate processing method

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Tokyo, Japan

Takashi Mitsuya