IDiyas

For the Inventor, By the Inventor

Tsukuba, Japan

Takashi Kawamori

USPTO Granted Patents = 13


Average Co-Inventor Count = 3.5

ph-index = 3

Forward Citations = 26(Granted Patents)


Location History:

  • Ibaraki, JP (2013 - 2014)
  • Tsukuba, JP (2010 - 2020)

Company Filing History:

goldMedal13 out of 1,641 
 
Hitachi Chemical Company, Ltd.
 patents

Years Active: 2010-2020

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13 patents (USPTO):
1. 10629457 - Method for manufacturing semiconductor device (2020-04-21),
2. 10504864 - Adhesive composition, electronic-component-mounted substrate and semiconductor device using the adhesive composition (2019-12-10),
3. 9309446 - Photosensitive adhesive composition, film-like adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, semiconductor device (2016-04-12),
4. 9247652 - Adhesive composition, electronic-component-mounted substrate and semiconductor device using the adhesive composition (2016-01-26),
5. 8673539 - Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part (2014-03-18),
6. 8507323 - Method of producing semiconductor device with patterned photosensitive adhesive (2013-08-13),
7. 8445177 - Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part (2013-05-21),
8. 8349700 - Photosensitive adhesive, semiconductor device and method for manufacturing semiconductor device (2013-01-08),
9. 8323873 - Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part (2012-12-04),
10. 8293453 - Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part (2012-10-23),
11. 8278024 - Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part (2012-10-02),
12. 8258017 - Photosensitive adhesive (2012-09-04),
13. 7851131 - Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part (2010-12-14),

Title: The Innovative Contributions of Takashi Kawamori

Introduction

Takashi Kawamori is a prominent inventor based in Tsukuba, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 13 patents. His work focuses on improving production efficiency and reliability in semiconductor devices.

Latest Patents

Kawamori's latest patents include a method for manufacturing semiconductor devices that enhances production efficiency. This method involves attaching a sealing material to seal a semiconductor element, utilizing a release film in a mold, and curing the sealing material with upper and lower molds. Additionally, he has developed an adhesive composition that maintains storage stability and enhances adhesive properties, electroconductivity, and reliability for mounting electronic components.

Career Highlights

Kawamori is currently associated with Hitachi Chemical Company, Ltd., where he continues to innovate in semiconductor manufacturing processes. His expertise has led to advancements that benefit the electronics industry significantly.

Collaborations

Throughout his career, Kawamori has collaborated with notable colleagues, including Takashi Masuko and Shigeki Katogi. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.

Conclusion

Takashi Kawamori's contributions to semiconductor technology exemplify the impact of innovative thinking in the field. His patents and collaborative efforts continue to shape the future of electronics manufacturing.

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