The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 13, 2013

Filed:

Jul. 18, 2012
Applicants:

Takashi Masuko, Ibaraki, JP;

Takashi Kawamori, Ibaraki, JP;

Kazuyuki Mitsukura, Ibaraki, JP;

Shigeki Katogi, Ibaraki, JP;

Inventors:

Takashi Masuko, Ibaraki, JP;

Takashi Kawamori, Ibaraki, JP;

Kazuyuki Mitsukura, Ibaraki, JP;

Shigeki Katogi, Ibaraki, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 21/48 (2006.01); H01L 21/50 (2006.01);
U.S. Cl.
CPC ...
Abstract

A photosensitive adhesive capable of alkali development, the photosensitive adhesive exhibiting adhesion property for an adherend after it has been patterned by light exposure and development, the photosensitive adhesive being used in a method for producing a semiconductor devicecomprising a step of patterning the photosensitive adhesiveprovided on a circuit surface of a semiconductor chipby light exposure and development; and a step of directly bonding another semiconductor chipto the patterned photosensitive adhesive


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