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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10629457 B1

PDFFull Text
Date of Patent:
Apr. 21, 2020

Filed:

Jun. 05, 2013

Method for manufacturing semiconductor device

Applicant:

Hitachi Chemical Company, Ltd., Tokyo, JP;

Inventors:

Takashi Kawamori, Tsukuba, JP;

Naoya Suzuki, Tsukuba, JP;

Assignee:

HITACHI CHEMICAL COMPANY, LTD., Tokyo, JP;

Attorney:

Fitch, Even, Tabin & Flannery, L.L.P.

Primary Examiner:

David A Zarneke

Int. Cl.
CPC ...
H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 25/065 (2006.01); H01L 23/552 (2006.01); H05K 3/28 (2006.01); H01L 23/60 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/566 (2013.01); H01L 21/561 (2013.01); H01L 21/565 (2013.01); H01L 23/3121 (2013.01); H01L 23/552 (2013.01); H01L 23/60 (2013.01); H01L 25/0652 (2013.01); H05K 3/284 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 25/0655 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/181 (2013.01); H01L 2924/3025 (2013.01); H05K 2201/0715 (2013.01); H05K 2203/1316 (2013.01);
Abstract

Provided is a method for manufacturing a semiconductor device through which improvement of production efficiency can be achieved. In the method of manufacturing the semiconductor device (), a sealing material () is attached to seal a semiconductor element (), a release film (F) is provided in a mold facing the semiconductor element (), and the sealing material () is cured by an upper mold () and a lower mold (). A metal layer () that shields electromagnetic waves is previously provided on a side of the release film (F) coming in contact with the sealing material (). In the curing of the sealing material (), the metal layer () is transferred to the sealing material ().

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