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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9247652 B1

PDFFull Text
Date of Patent:
Jan. 26, 2016

Filed:

Oct. 02, 2008

Adhesive composition, electronic-component-mounted substrate and semiconductor device using the adhesive composition

Applicants:

Kaoru Konno, Tsukuba, JP;

Hiroki Hayashi, Tsukuba, JP;

Takashi Kawamori, Tsukuba, JP;

Inventors:

Kaoru Konno, Tsukuba, JP;

Hiroki Hayashi, Tsukuba, JP;

Takashi Kawamori, Tsukuba, JP;

Assignee:

HITACHI CHEMICAL COMPANY, LTD., Tokyo, JP;

Attorney:

Fitch, Even, Tabin and Flannery LLP

Primary Examiner:

Monique Jackson

Int. Cl.
CPC ...
B32B 15/02 (2006.01); H01B 1/02 (2006.01); H01B 1/22 (2006.01); H05K 3/32 (2006.01); B22F 1/00 (2006.01); B23K 35/02 (2006.01); B23K 35/26 (2006.01); B23K 35/30 (2006.01); B23K 35/36 (2006.01); B23K 35/362 (2006.01); B23K 35/365 (2006.01); C09J 9/02 (2006.01); C09J 11/04 (2006.01); H01L 23/00 (2006.01); C08K 3/00 (2006.01); C08K 3/08 (2006.01); H05K 1/14 (2006.01);
U.S. Cl.
CPC ...
H05K 3/321 (2013.01); B22F 1/0059 (2013.01); B23K 35/025 (2013.01); B23K 35/0244 (2013.01); B23K 35/262 (2013.01); B23K 35/264 (2013.01); B23K 35/302 (2013.01); B23K 35/362 (2013.01); B23K 35/365 (2013.01); B23K 35/3613 (2013.01); B23K 35/3618 (2013.01); C09J 9/02 (2013.01); C09J 11/04 (2013.01); H01B 1/22 (2013.01); H01L 24/12 (2013.01); B22F 2001/0066 (2013.01); C08K 3/0066 (2013.01); C08K 3/08 (2013.01); H01L 24/16 (2013.01); H01L 2224/13099 (2013.01); H01L 2224/16 (2013.01); H01L 2924/0103 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01009 (2013.01); H01L 2924/01012 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01015 (2013.01); H01L 2924/01019 (2013.01); H01L 2924/01022 (2013.01); H01L 2924/01027 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01046 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01057 (2013.01); H01L 2924/01074 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/15747 (2013.01); H01L 2924/19043 (2013.01); H05K 1/141 (2013.01); H05K 2201/0272 (2013.01); H05K 2203/0425 (2013.01); Y10T 428/31511 (2015.04); Y10T 428/31678 (2015.04);
Abstract

There are provided are an adhesive composition that keeps storage stability and further gives a cured product wherein metallic bonds are formed in the state that the cured product wets its components and is satisfactorily spread between the components (or parts), thereby turning excellent in adhesive property, electroconductivity, and reliability for mounting such as TCT resistance or high-temperature standing resistance; an electronic-component-mounted substrate using the same; and a semiconductor device. The adhesive composition comprises electroconductive particles (A) and a binder component (B), wherein the electroconductive particles (A) include a metal (a1) having a melting point equal to or higher than the reflow temperature and containing no lead, and a metal (a2) having a melting point lower than the reflow temperature and containing no lead, and the binder component (B) includes a thermosetting resin composition (b1) and an aliphatic dihydroxycarboxylic acid (b2).

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