The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 12, 2016
Filed:
Mar. 02, 2012
Applicants:
Kazuyuki Mitsukura, Tsukuba, JP;
Takashi Kawamori, Tsukuba, JP;
Takashi Masuko, Tsukuba, JP;
Shigeki Katogi, Tsukuba, JP;
Inventors:
Kazuyuki Mitsukura, Tsukuba, JP;
Takashi Kawamori, Tsukuba, JP;
Takashi Masuko, Tsukuba, JP;
Shigeki Katogi, Tsukuba, JP;
Assignee:
HITACHI CHEMICAL COMPANY, LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/00 (2006.01); G03F 7/004 (2006.01); C09J 7/02 (2006.01); H01L 23/00 (2006.01); G03F 7/027 (2006.01); G03F 7/037 (2006.01); G03F 7/038 (2006.01); C08G 73/10 (2006.01); C09J 179/08 (2006.01); H01L 21/683 (2006.01); H01L 25/065 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
C09J 7/0203 (2013.01); C08G 73/105 (2013.01); C09J 179/08 (2013.01); G03F 7/027 (2013.01); G03F 7/037 (2013.01); G03F 7/038 (2013.01); H01L 21/6836 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 25/0657 (2013.01); C09J 2203/326 (2013.01); C09J 2205/31 (2013.01); C09J 2433/00 (2013.01); C09J 2463/00 (2013.01); C09J 2479/08 (2013.01); H01L 23/293 (2013.01); H01L 23/3128 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 24/92 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68377 (2013.01); H01L 2224/27002 (2013.01); H01L 2224/27416 (2013.01); H01L 2224/27436 (2013.01); H01L 2224/27622 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/92247 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06568 (2013.01); H01L 2924/0102 (2013.01); H01L 2924/014 (2013.01); H01L 2924/0104 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01012 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01019 (2013.01); H01L 2924/01023 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01044 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01051 (2013.01); H01L 2924/01073 (2013.01); H01L 2924/01077 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/09701 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/1461 (2013.01); H01L 2924/15788 (2013.01); Y10T 428/24802 (2015.01); Y10T 428/2817 (2015.01);
Abstract
The present invention relates to a photosensitive adhesive composition that has thermal press bondability to an adherent after being patterned by exposure and development and enables alkali development, wherein a storage elastic modulus at 110° C. after exposure and further heat curing is not less than 10 MPa.