The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 08, 2013
Filed:
Dec. 02, 2008
Takashi Masuko, Tsukuba, JP;
Takashi Kawamori, Tsukuba, JP;
Kazuyuki Mitsukura, Tsukuba, JP;
Shigeki Katogi, Tsukuba, JP;
Takashi Masuko, Tsukuba, JP;
Takashi Kawamori, Tsukuba, JP;
Kazuyuki Mitsukura, Tsukuba, JP;
Shigeki Katogi, Tsukuba, JP;
Hitachi Chemical Company, Ltd., Tokyo, JP;
Abstract
A method for manufacturing a semiconductor device, comprising a first step of providing a photosensitive adhesive (insulating resin layer) on a boardwhich has a connecting terminal, a second step of patterning the photosensitive adhesive by light exposure and development so that openingsare formed where the connecting terminal is exposed, a third step of filling the openingswith a conductive material to form a conductive layer, and a fourth step of directly bonding a semiconductor chiphaving a connecting electrode section to the photosensitive adhesive while electrically connecting the connecting terminal of the boardand the connecting electrode section of the semiconductor chipvia the conductive layer