Average Co-Inventor Count = 3.54
ph-index = 3
The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.
Company Filing History:
1. Hitachi Chemical Company, Ltd. (13 from 1,641 patents)
13 patents:
1. 10629457 - Method for manufacturing semiconductor device
2. 10504864 - Adhesive composition, electronic-component-mounted substrate and semiconductor device using the adhesive composition
3. 9309446 - Photosensitive adhesive composition, film-like adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, semiconductor device
4. 9247652 - Adhesive composition, electronic-component-mounted substrate and semiconductor device using the adhesive composition
5. 8673539 - Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part
6. 8507323 - Method of producing semiconductor device with patterned photosensitive adhesive
7. 8445177 - Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part
8. 8349700 - Photosensitive adhesive, semiconductor device and method for manufacturing semiconductor device
9. 8323873 - Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part
10. 8293453 - Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part
11. 8278024 - Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part
12. 8258017 - Photosensitive adhesive
13. 7851131 - Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part