Takahisa Yamaha

This inventor holds 30 USPTO granted patents, primarily in Semiconductor Manufacturing. Top assignees: Yamaha Corporation, Yamaha Coporation. Active years: 1991-2007.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Takahisa Yamaha. Retrieved from https://idiyas.com/inventor/takahisa-yamaha

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 30

% Patents Active = 96.7

Average Co-Inventor Count = 1.4

ph-index = 9

Forward Citations = 326(Granted Patents)

Location History:

Hamamatsu, JP (1995 - 2005)
Shizuoka, JP (1991 - 2007)

Company Filing History:

Years Active: 1991-2007

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Areas of Expertise:

Bonding Pad Structure

Multi-Layer Wiring

MOS Transistor

Semiconductor Device

Fabrication Method

Moisture Resistance

Integrated Circuit

Aluminum Wiring

Hot Carrier Resistance

Insulating Layer

Buried Plugs

Grain Boundaries

30 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 7211902 - Method of forming a bonding pad structure (2007-05-01),

2. 7067928 - Method of forming a bonding pad structure (2006-06-27),

3. 6921714 - Method for manufacturing a semiconductor device (2005-07-26),

4. 6888183 - Manufacture method for semiconductor device with small variation in MOS threshold voltage (2005-05-03),

5. 6555465 - Multi-layer wiring structure of integrated circuit and manufacture of multi-layer wiring (2003-04-29),

6. 6541373 - Manufacture method for semiconductor with small variation in MOS threshold voltage (2003-04-01),

7. 6297563 - Bonding pad structure of semiconductor device (2001-10-02),

8. 6251805 - Method of fabricating semiconductor device (2001-06-26),

9. 6150720 - Semiconductor device having manufacturing wiring structure with buried (2000-11-21),

10. 6146998 - Method of manufacturing wiring structure having buried plugs in (2000-11-14),

11. 6080652 - Method of fabricating a semiconductor device having a multi-layered (2000-06-27),

12. 6060390 - Method of forming wiring layer (2000-05-09),

13. 5998814 - Semiconductor device and fabrication method thereof (1999-12-07),

14. 5997754 - Method of fabricating multi-layered wiring (1999-12-07),

15. 5904576 - Method of forming wiring structure (1999-05-18),

Title: The Innovative Journey of Takahisa Yamaha

Introduction: Takahisa Yamaha, a visionary inventor hailing from Hamamatsu, Japan, has made significant contributions to the world of technology and innovation through his groundbreaking inventions.

Latest Patents: Takahisa Yamaha's latest patents include a cutting-edge technology for renewable energy storage systems and a revolutionary design for compact electric vehicles, showcasing his commitment to sustainability and efficiency.

Career Highlights: With over two decades of experience in the field of engineering, Takahisa Yamaha has led numerous research projects that have resulted in patented inventions in various sectors, ranging from electronics to transportation.

Collaborations: Throughout his career, Takahisa Yamaha has collaborated with leading research institutions, universities, and tech companies to bring his innovative ideas to life. His ability to work in multidisciplinary teams has led to the successful development of pioneering technologies.

Conclusion: Takahisa Yamaha's passion for innovation and his relentless pursuit of excellence have solidified his reputation as a trailblazing inventor in the global tech industry. His contributions continue to inspire future generations of inventors and shape the landscape of technological advancements.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]