The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 18, 1999

Filed:

Oct. 30, 1997
Applicant:
Inventors:

Takahisa Yamaha, Hamamatsu, JP;

Yushi Inoue, Hamatasu, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
438788 ; 438788 ; 438787 ; 438629 ; 438763 ; 257634 ; 257635 ;
Abstract

After wiring patterns are formed on an insulating film covering the surface of a substrate, an insulating film such as plasma CVD SiO.sub.2 is formed covering the wiring patterns. A hydrogen silsesquioxane resin film with a flat surface is formed by spin coating or the like on the insulating film. Thereafter, the resin film is changed into a pre-ceramic silicon oxide film by performing heat treatment in an inert gas atmosphere. On this pre-ceramic silicon oxide film, an insulating film such as plasma enhanced CVD SiO.sub.2 film is formed and another wiring layer is formed on the insulating film. This method of forming a multi-layer wiring structure allows an interlayer insulating film to be planarized, and improves a yield of wiring formation.


Find Patent Forward Citations

Yamaha, Takahisa. (1999). Method of forming wiring structure (U.S. Patent No. 5904576). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5904576

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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