The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 14, 2000
Filed:
Aug. 24, 1998
Takahisa Yamaha, Hamamatsu, JP;
Tetsuya Kuwajima, Hamamatsu, JP;
Yamaha Corporation, , JP;
Abstract
In a wiring forming method according to the present invention, an insulating layer is formed on a semiconductor substrate, and contact holes are formed in the insulating layer. A titanium layer is deposited on the insulating layer so as to be along inner surfaces of the contact holes. A first titanium nitride layer is formed on the titanium layer including the titanium layer formed in the contact holes. The deposition of the first titanium nitride layer is carried out under atmosphere which substantially includes no oxygen. A titanium oxynitride layer is deposited on the first titanium nitride layer. A second titanium nitride layer is deposited on the titanium oxynitride layer. Buried plugs are formed on the second titanium nitride layer formed in the contact holes. A wiring connected to the buried plugs are formed on the insulating layer. A barrier metal layer and the buried plugs are thus formed in the contact holes. According to such the structure, a stable electric contact can be obtained.