Yokohama, Japan

Takahiro Aizawa

USPTO Granted Patents = 6 

Average Co-Inventor Count = 3.9

ph-index = 1

Forward Citations = 4(Granted Patents)


Location History:

  • Kanagawa-ken, JP (2012)
  • Yokohama, JP (2015 - 2022)

Company Filing History:


Years Active: 2012-2025

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6 patents (USPTO):Explore Patents

Title: The Innovations of Takahiro Aizawa

Introduction

Takahiro Aizawa is a prominent inventor based in Yokohama, Japan. He has made significant contributions to the field of technology, particularly in battery design and ultrasonic bonding apparatus. With a total of 6 patents to his name, Aizawa continues to push the boundaries of innovation.

Latest Patents

One of Aizawa's latest patents involves a battery design that includes an exterior container, a lid member, and a plurality of electrode groups. This innovative battery features a first lead and a second lead, which are connected to an electrode terminal exposed on the outer surface of the lid member. Another notable patent is for an ultrasonic bonding apparatus that includes a sensor detecting vibration along a height direction in a bonding target member. This apparatus is equipped with a control device that adjusts control parameters based on the detected vibration, enhancing the bonding process.

Career Highlights

Throughout his career, Aizawa has worked with notable companies such as Toshiba Corporation and Shibaura Mechatronics Corporation. His experience in these organizations has allowed him to develop and refine his innovative ideas, contributing to advancements in technology.

Collaborations

Aizawa has collaborated with several talented individuals in his field, including Takashi Ito and Masatoshi Tanabe. These collaborations have fostered a creative environment that has led to the development of groundbreaking technologies.

Conclusion

Takahiro Aizawa's contributions to the field of technology through his patents and collaborations highlight his role as an influential inventor. His work continues to inspire innovation in battery technology and ultrasonic bonding methods.

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