The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 08, 2026
Filed:
Mar. 14, 2025
Kabushiki Kaisha Toshiba, Tokyo, JP;
Kioxia Corporation, Tokyo, JP;
Masatoshi Tanabe, Yokohama, JP;
Takashi Ito, Fujisawa, JP;
Takahiro Aizawa, Yokohama, JP;
Akira Tojo, Naka, JP;
Yasunari Ukita, Kamakura, JP;
KABUSHIKI KAISHA TOSHIBA, Tokyo, JP;
Kioxia Corporation, Tokyo, JP;
Abstract
According to one embodiment, a controller of a wire bonding apparatus is configured to calculate a height of a bump based on a diameter of a ball-shaped portion detected by a diameter detecting part, a first position of a bonding tool detected by a position detecting part when a load sensor detects a load at a first bonding point, and a second position of the bonding tool when the bonding tool is lowered at the first bonding point, and to bond a wire based on the calculated height of the bump.