The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 24, 2026
Filed:
Feb. 08, 2024
Kabushiki Kaisha Toshiba, Tokyo, JP;
Yuto Shinohara, Yokohama Kanagawa, JP;
Takahiro Aizawa, Yokohama Kanagawa, JP;
Takashi Ito, Fujisawa Kanagawa, JP;
Kabushiki Kaisha Toshiba, Kawasaki, JP;
Abstract
According to one embodiment, an ultrasonic bonding method for bonding a plurality of bonding members together by applying pressure and an ultrasonic wave includes a pressing step of applying pressure to one bonding member and another bonding member so as to press against each other, an application step of applying an ultrasonic wave to the one bonding member, a detection step of detecting a vibration state of another bonding member during the application step, and a step of determining a state of bonding between the bonding members based on the vibration state acquired in the detection step.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile